AN44071A
33
Ver. BEB
USAGE NOTES
1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed
operating conditions (operating power supply voltage and operating environment etc.). Especially, please be
careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off
and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as
redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical
injury, fire, social damages, for example, by using the products.
2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external
factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's
process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf
life and the elapsed time since first opening the packages.
3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-
board), it might smoke or ignite.
4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit
between pins. In addition, refer to the Pin Description for the pin configuration.
5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to
problems such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical
verification on the assembly quality, because the same damage possibly can happen due to conductive
substances, such as solder ball, that adhere to the LSI during transportation.
6. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs
such as output pin-VM short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin
short (load short) .
Especially, for the pins below, take notice Power supply fault, Ground fault, short to motor current detection pin,
load short and short between the pin.
・Motor drive output pin (Pin 1, 5, 24, 28, 29, 33, 52, 56)
・Motor current detection pin (Pin 3, 26, 31, 54)
・Charge pump circuit pin (Pin 16, 17, 18)
・Power supply (Pin 41, 43)
And, safety measures such as an installation of fuses are recommended because the extent of the above-
mentioned damage and smoke emission will depend on the current capability of the power supply.
7. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit
should not work during normal operation.
Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is
momentarily exceeded due to output pin to VM short (Power supply fault), or output pin to GND short (Ground
fault), the LSI might be damaged before the thermal protection circuit could operate.
8. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not
applied to the pins because the device might be damaged, which could happen due to negative voltage or
excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator
coils of optical pick-up is being driven.
9. The product which has specified ASO (Area of Safe Operation) should be operated in ASO.
10. Verify the risks which might be caused by the malfunctions of external components.
