NX1-25T-KT9K(05)

B2
Simple Assembly Type PC Card Frame Kits
NX1 Series
Simple Assembly Method
Features
1. Great reduction of the number of frame kit
assembly steps
Use of this simple assembly method has greatly reduced the
number of assembly steps. Processes such heat fusion and
cooling of the covers are no longer required. Assembly of the
frame kit is possible using simple jig tools. (See the Simple
Assembly Method insert to the right.).
2. Excellent Shielding Qualities
The covered construction using a metal panel out to the sides of
the card provide excellent shielding qualities. (See Figure 4.)
3. Board Offset
Available in types with board offsets of 0.3mm and 0.9mm.
4. Back connectors
Back Connectors available with 15,25, and 32 contacts.
5. Can Be Used With CardBus Types
6. Stable Conduction Maintained Between Panels
The spring quality of the metal ensures stable conduction to be
maintained between the panels at the panel lock portion.
7. Conduction Maintained Between Panel and Board
The cunduction between panel and board is maintained by
contact between the panel and a one-body ground spring.
Applications
A wide variety of PC cards including LAN, FAX modem, and
SCSI.
Figure 1
Figure 4
Figure 3
Figure 2
Frame+Metal panel
68-contact socket
Back connector
Metal panel covers all the
way to the card sides
(For details, see the frame Kit assembly procedure on page 6)
B3
NX1B L - 32 T - KT 3 B
(
05
)
q w e r t y u i
Ordering Information
Materials
Product Rating
q Series name
NX1 : General type
NX1B : Card bus type
r Suitable back connectors
T: NX Series
u Type of suitable 68-contact connectors
K: General type (IC1K Series)
B: Card Bus type (IC9 Series)
i Presence of insulation tape
05 : With insulation tape
06 : Without insulation tape
t Connector type
KT: Frame kit
y Offset
3: 0.3mm
9: 0.9mm
w Card key type
None: 5 V type
L : 3.3 V type
e Number of back connector
15, 25, or 32
Connector Mounting Condition
0.9mm Offset Type 0.3mm Offset Type
(Panel thickness
+ Insulation tape thickness)
0.25
5 MAX
0.5 MAX
3.1
0.8
0.9
3.3
Panel
SMT
contacts
Connector
portion
PCB
0.05
3.3
(Panel thickness
+ Insulation tape thickness)
0.25
5 MAX
0.5 MAX
2.5
1.4
0.3
Panel
SMT
contacts
Connector
portion
0.05
Label Dimensions(Recommended Label Thickness: 50µm)
38±0.2
63±0.2
4-R3.5±0.2
Operating temperature range
Part Material Color Remarks
UL94V-0
-------
510-FR
Black
Dull Finish
Black
PBT
Stainless steel
Polyester
Frame
Panel
Insulation tape
-30ç to +70ç
B4
Suitable 68-Contact Socket Connectors
Suitable Back Connectors
Part Number
NX60TB-15SAA9-SP
NX60TB-15SAA3-SP
NX60TA-25SAA9-SP
NX60TA-25SAA3-SP
NX60TB-32SAA9-SP
NX60TA-32SAA3-SP
Part Number
IC1K-68RD-1.27SFA
IC1K-68RD-1.27SF
IC1K-68RD-1.27SFA
IC1K-68RD-1.27SF
IC1K-68RD-1.27SFA
IC1K-68RD-1.27SF
CL No.
640-0047-2
640-0046-0
640-0047-2
640-0046-0
640-0047-2
640-0046-0
NX1 Series (General Type Frame Kit)
Panel A Panel B
Number of
Contacts
15
25
32
Offset
(mm)
0.9
0.3
0.9
0.3
0.9
0.3
Frame Kit
Part Number
NX1-15T-KT9K
(
**
)
NX1-15T-KT3K
(
**
)
NX1-25T-KT9K
(
**
)
NX1-25T-KT3K
(
**
)
NX1-32T-KT9K
(
**
)
NX1-32T-KT3K
(
**
)
CL No.
234-2102-5-**
234-2103-8-**
234-2104-0-**
234-2105-3-**
234-2106-6-**
234-2107-9-**
CL No.
234-0097-6
234-0098-9
234-0107-8
234-0033-3
234-0023-0
234-0053-0
(
**
) :
(
05
)
: With Insulation type
(
**
) :
(
06
)
: Without Insulation type

NX1-25T-KT9K(05)

Mfr. #:
Manufacturer:
Hirose Electric
Description:
Memory Connectors Memory Card Connectors PC CARD FRAME KIT 5V ACCESRY OFFSET-.9MM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union