AD9573
Rev. 0 | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter Rating
VDD, VDDA, VDDX, and VDD33 to GND −0.3 V to +3.6 V
XO1, XO2 to GND −0.3 V to V
S
+ 0.3 V
100M, 100M, 33M to GND
−0.3 V to V
S
+ 0.3 V
Junction Temperature
1
150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (10 sec) 300°C
1
See Table 9 for θ
JA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Thermal impedance measurements were taken on a 4-layer
board in still air in accordance with EIA/JESD51-7.
Table 9. Thermal Resistance
Package Type θ
JA
Unit
16-Lead TSSOP 90.3 °C/W
ESD CAUTION
1
2
3
4
5
6
7
8
VDDA
VDDX
XO1
GNDA
GNDX
XO2
GNDA
VDDA
16
15
14
13
GND
100M
100M
33M
GND3
VDD3
VDD
OE
12
11
10
9
3
3
D9573
50Ω
R
T
=
100Ω
50Ω
1nF0.1µF
0.1µF
0.
VS
1µF
VS
VS
0.1µF
0.1µF
Cx
Cx
CRYSTAL:
KYOCERA CX-49G
Cx = 33pF
VS
VS
07500-002
Figure 4. Typical Application