EMIF02-USB04F3 Package information
Doc ID 18144 Rev 1 5/7
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 11. Package dimensions
Figure 14. Flip Chip tape and reel specification
Figure 12. Footprint Figure 13. Marking
1.14 mm ± 30 µm
1.14 mm ± 30 µm
255 µm ± 40
400 µm ± 40
400 µm ± 40
170 µm ± 10
170 µm ± 10
500 µm ± 50
220 µm recommended
220 µm recommended
260 µm maximum
Solder stencil opening:
Copper pad Diameter:
Solder mask opening:
300 µm minimum
x
y
x
w
z
w
Dot, ST logo
xx = marking
yww = datecode
(y = year
ww = week)
z = manufacturing location
ECOPAK grade
User direction of unreeling
All dimensions in mm
4.0 ± 0.1
2.0 ± 0.05
8.0 ± 0.3
1.75 ± 0.1
3.5 ±- 0.1
Ø 1.5 ± 0.1
0.69 ± 0.05
1.24
1.24
4.0 ± 0.1
xxz
yww
xxz
yww
xxz
yww
xxz
yww
xxz
yww
xxz
yww
Dot identifying Pin A1 location
