MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
16 Freescale Semiconductor
DDR2 SDRAM
MCS output hold with respect to MCK t
DDKHCX
ns 3
266 MHz 2.5
MCK to MDQS Skew t
DDKHMH
–0.6 0.6 ns 4
MDQ/MDM output setup with respect to MDQS t
DDKHDS,
t
DDKLDS
ns 5
266 MHz 0.9
MDQ/MDM output hold with respect to MDQS t
DDKHDX,
t
DDKLDX
ps 5
266 MHz 1100
MDQS preamble start t
DDKHMP
0.75 x t
MCK
—ns6
MDQS epilogue end t
DDKHME
0.4 x t
MCK
0.6 x t
MCK
ns 6
Notes:
1. The symbols used for timing specifications follow the pattern of t
(first two letters of functional block)(signal)(state)(reference)(state)
for
inputs and t
(first two letters of functional block)(reference)(state)(signal)(state)
for outputs. Output hold time can be read as DDR timing
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
t
DDKHAS
symbolizes DDR timing (DD) for the time t
MCK
memory clock reference (K) goes from the high (H) state until outputs
(A) are setup (S) or output valid time. Also, t
DDKLDX
symbolizes DDR timing (DD) for the time t
MCK
memory clock reference
(K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK
, MCS, and MDQ/MDM/MDQS. For the ADDR/CMD
setup and hold specifications, it is assumed that the Clock Control register is set to adjust the memory clocks by 1/2 applied
cycle.
4. Note that t
DDKHMH
follows the symbol conventions described in note 1. For example, t
DDKHMH
describes the DDR timing (DD)
from the rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). t
DDKHMH
can be modified through control
of the DQSS override bits in the TIMING_CFG_2 register. This is typically set to the same delay as the clock adjusts in the
CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same
adjustment value. See the MPC
8306S PowerQUICC II Pro Integrated Communications Processor Family Reference
Manual for a description and understanding of the timing modifications enabled by use of these bits.
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), or data
mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor.
6. t
DDKHMP
follows the symbol conventions described in note 1.
Table 16. DDR2 SDRAM Output AC Timing Specifications (continued)
At recommended operating conditions with GV
DD
of 1.8V ± 100mV.
Parameter Symbol
1
Min Max Unit Note
MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
Freescale Semiconductor 17
DDR2 SDRAM
The following figure shows the DDR SDRAM output timing for the MCK to MDQS skew measurement
(t
DDKHMH
).
Figure 5. Timing Diagram for t
DDKHMH
The following figure shows the DDR2 SDRAM output timing diagram.
Figure 6. DDR2 SDRAM Output Timing Diagram
MDQS
MCK
MCK
t
MCK
MDQS
t
DDKHMH
(max) = 0.6 ns
t
DDKHMH
(min) = –0.6 ns
ADDR/CMD
t
DDKHAS
,t
DDKHCS
t
DDKHMH
t
DDKLDS
t
DDKHDS
MDQ[x]/
MDQS[n]
MCK[n]
MCK[n]
t
MCK
t
DDKLDX
t
DDKHDX
D1D0
t
DDKHAX
,t
DDKHCX
Write A0 NOOP
t
DDKHME
t
DDKHMP
MECC[x]
MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
18 Freescale Semiconductor
Local Bus
7 Local Bus
This section describes the DC and AC electrical specifications for the local bus interface of the
MPC8306S.
7.1 Local Bus DC Electrical Characteristics
The following table provides the DC electrical characteristics for the local bus interface.
7.2 Local Bus AC Electrical Specifications
The following table describes the general timing parameters of the local bus interface of the MPC8306S.
Table 17. Local Bus DC Electrical Characteristics
Parameter Symbol Min Max Unit
High-level input voltage V
IH
2OV
DD
+0.3 V
Low-level input voltage V
IL
–0.3 0.8 V
High-level output voltage, I
OH
= –100 AV
OH
OV
DD
–0.2 V
Low-level output voltage, I
OL
=100AV
OL
—0.2V
Input current I
IN
—±5A
Table 18. Local Bus General Timing Parameters
Parameter Symbol
1
Min Max Unit Note
Local bus cycle time t
LBK
15 ns 2
Input setup to local bus clock (LCLKn)t
LBIVKH
7 ns 3, 4
Input hold from local bus clock (LCLKn)t
LBIXKH
1.0 ns 3, 4
Local bus clock (LCLKn) to output valid t
LBKHOV
—3ns3
Local bus clock (LCLKn) to output high impedance for LAD/LDP t
LBKHOZ
—4ns5
Notes:
1. The symbols used for timing specifications follow the pattern of t
(first two letters of functional block)(signal)(state)(reference)(state)
for
inputs and t
(first two letters of functional block)(reference)(state)(signal)(state)
for outputs. For example, t
LBIXKH1
symbolizes local bus
timing (LB) for the input (I) to go invalid (X) with respect to the time the t
LBK
clock reference (K) goes high (H), in this case
for clock one(1).
2. All timings are in reference to falling edge of LCLK0 (for all outputs and for LGTA
and LUPWAIT inputs) or rising edge of
LCLK0 (for all other inputs).
3. All signals are measured from OV
DD
/2 of the rising/falling edge of LCLK0 to 0.4 OV
DD
of the signal in question for 3.3-V
signaling levels.
4. Input timings are measured at the pin.
5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.

MPC8306SCVMADDCA

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NXP / Freescale
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Microprocessors - MPU E300 MP ext tmp 266
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