MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
10 Freescale Semiconductor
Power Characteristics
Figure 3. MPC8306S Power-Up Sequencing Example
3 Power Characteristics
The typical power dissipation for this family of MPC8306S devices is shown in the following table.
Table 5. MPC8306S Power Dissipation
Core
Frequency (MHz)
QUICC Engine
Frequency (MHz)
CSB
Frequency (MHz)
Typical Maximum Unit Note
133 133 133 0.272 0.618 W 1, 2, 3
200 233 133 0.291 0.631 W 1, 2, 3
266 233 133 0.451 0.925 W 1, 2, 3
333 233 133 0.471 0.950 W 1, 2, 3
Notes:
1. The values do not include I/O supply power (OV
DD
and GV
DD
), but it does include V
DD
and AV
DD
power. For I/O power
values, see Tab l e 6 .
2. Typical power is based on a nominal voltage of V
DD
= 1.0 V, ambient temperature, and the core running a Dhrystone
benchmark application. The measurements were taken on the evaluation board using WC process silicon.
3. Maximum power is based on a voltage of V
DD
= 1.05 V, WC process, a junction T
J
= 105C, and a smoke test code.
t
90%
V
Core Voltage (V
DD
)
I/O Voltage (GV
DD
and OV
DD
)
0
0.7 V
PORESET
>= 32 t
SYS_CLK_IN
MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
Freescale Semiconductor 11
Clock Input Timing
The following table shows the estimated typical I/O power dissipation for the device.
4 Clock Input Timing
This section provides the clock input DC and AC electrical characteristics for the MPC8306S.
NOTE
The rise/fall time on QUICC Engine input pins should not exceed 5 ns. This
should be enforced especially on clock signals. Rise time refers to signal
transitions from 10% to 90% of OV
DD
; fall time refers to transitions from
90% to 10% of OV
DD
.
4.1 DC Electrical Characteristics
The following table provides the clock input (SYS_CLK_IN) DC specifications for the MPC8306S. These
specifications are also applicable for QE_CLK_IN.
Table 6. Typical I/O Power Dissipation
Interface Parameter
GV
DD
(1.8 V)
OV
DD
(3.3 V)
Unit Comments
DDR I/O
65% utilization
1.8 V
R
s
= 20
R
t
= 50
1 pair of clocks
266 MHz, 1 16 bits 0.141 W
Local bus I/O load = 25 pF
1 pair of clocks
66 MHz, 26 bits
—0.150 W 1
QUICC Engine block and other I/Os TDM serial, HDLC/TRAN serial,
DUART, MII, RMII, Ethernet
management, USB, SPI, Timer
output,
Note:
1. Typical I/O power is based on a nominal voltage of V
DD
= 3.3V, ambient temperature, and the core running a Dhrystone
benchmark application. The measurements were taken on the evaluation board using WC process silicon.
Table 7. SYS_CLK_IN DC Electrical Characteristics
Parameter Condition Symbol Min Max Unit
Input high voltage V
IH
2.4 OV
DD
+0.3 V
Input low voltage V
IL
–0.3 0.4 V
SYS_CLK_IN input current 0 V V
IN
OV
DD
I
IN
—±5A
SYS_CLK_IN input current 0 V V
IN
0.5 V or
OV
DD
– 0.5 V V
IN
OV
DD
I
IN
—±5A
SYS_CLK_IN input current 0.5 V V
IN
OV
DD
– 0.5 V I
IN
—±50A
MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
12 Freescale Semiconductor
RESET Initialization
4.2 AC Electrical Characteristics
The primary clock source for the MPC8306S is SYS_CLK_IN. The following table provides the clock
input (SYS_CLK_IN) AC timing specifications for the MPC8306S. These specifications are also
applicable for QE_CLK_IN.
5 RESET Initialization
This section describes the AC electrical specifications for the reset initialization timing requirements of
the MPC8306S. The following table provides the reset initialization AC timing specifications for the reset
component(s).
Table 8. SYS_CLK_IN AC Timing Specifications
Parameter/Condition Symbol Min Typical Max Unit Note
SYS_CLK_IN frequency f
SYS_CLK_IN
24 — 66.67 MHz 1
SYS_CLK_IN cycle time t
SYS_CLK_IN
15 41.6 ns
SYS_CLK_IN rise and fall time t
KH
, t
KL
1.1 2.8 ns 2
SYS_CLK_IN duty cycle t
KHK
/t
SYS_CLK_
IN
40 60 % 3
SYS_CLK_IN jitter ±150 ps 4, 5
Notes:
1. Caution: The system, core and QUICC Engine block must not exceed their respective maximum or minimum operating
frequencies.
2. Rise and fall times for SYS_CLK_IN are measured at 0.33 and 2.97 V.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. The SYS_CLK_IN driver’s closed loop jitter bandwidth should be < 500 kHz at –20 dB. The bandwidth must be set low to
allow cascade-connected PLL-based devices to track SYS_CLK_IN drivers with the specified jitter.
6. Spread spectrum is allowed up to 1% down-spread @ 33kHz (max rate).
Table 9. RESET Initialization Timing Specifications
Parameter/Condition Min Max Unit Note
Required assertion time of HRESET
to activate reset flow 32 t
SYS_CLK_IN
1
Required assertion time of PORESET with stable clock applied to
SYS_CLK_IN
32 t
SYS_CLK_IN
1
HRESET
assertion (output) 512 t
SYS_CLK_IN
1
Input setup time for POR configuration signals
(CFG_RESET_SOURCE[0:3]) with respect to negation of PORESET
4—t
SYS_CLK_IN
1, 2
Input hold time for POR config signals with respect to negation of
HRESET
0 ns 1, 2
Notes:
1. t
SYS_CLK_IN
is the clock period of the input clock applied to SYS_CLK_IN. For more details, see the MPC8306S PowerQUICC
II Pro Integrated Communications Processor Family Reference Manual.
2. POR configuration signals consist of CFG_RESET_SOURCE[0:3].

MPC8306SCVMAFDCA

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Manufacturer:
NXP / Freescale
Description:
Microprocessors - MPU E300 MP ext tmp 333
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