NCP3063, NCP3063B, NCV3063
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3
PIN DESCRIPTION
Pin No. Pin Name Description
1 Switch Collector Internal Darlington switch collector
2 Switch Emitter Internal Darlington switch emitter
3 Timing Capacitor
Oscillator Input
Timing Capacitor
4 GND Ground pin for all internal circuits
5 Comparator
Inverting Input
Inverting input pin of internal comparator
6 V
CC
Voltage Supply
7 I
pk
Sense Peak Current Sense Input to monitor the voltage drop across an external resistor to limit the peak
current through the circuit
8 N.C. Pin Not Connected
Exposed
Pad
Exposed Pad The exposed pad beneath the package must be connected to GND (Pin 4). Additionally, using
proper layout techniques, the exposed pad can greatly enhance the power dissipation capabilities
of the NCP3063.
MAXIMUM RATINGS (measured vs. Pin 4, unless otherwise noted)
Rating
Symbol Value Unit
V
CC
pin 6 V
CC
0 to +40 V
Comparator Inverting Input pin 5 V
CII
−0.2 to + V
CC
V
Darlington Switch Collector pin 1 V
SWC
0 to +40 V
Darlington Switch Emitter pin 2 (transistor OFF) V
SWE
−0.6 to + V
CC
V
Darlington Switch Collector to Emitter pin 1−2 V
SWCE
0 to +40 V
Darlington Switch Current I
SW
1.5 A
I
pk
Sense Pin 7 V
IPK
−0.2 to V
CC
+ 0.2 V
Timing Capacitor Pin 3 V
TCAP
−0.2 to +1.4 V
POWER DISSIPATION AND THERMAL CHARACTERISTICS
Rating
Symbol Value Unit
PDIP−8 Thermal Resistance, Junction−to−Air
R
q
JA
100 °C/W
SOIC−8 Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
R
q
JA
R
q
JC
180
45
°C/W
DFN−8 Thermal Resistance, Junction−to−Air
R
q
JA
80 °C/W
Storage Temperature Range T
STG
−65 to +150 °C
Maximum Junction Temperature
T
J
MAX
+150 °C
Operating Junction Temperature Range (Note 3) NCP3063
NCP3063B, NCV3063
T
J
0 to +70
−40 to +125
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Pin 1−8: Human Body Model 2000 V per AEC Q100−002; 003 or JESD22/A114; A115
Machine Model Method 200 V
2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.
3. The relation between junction temperature, ambient temperature and Total Power dissipated in IC is T
J
= T
A
+ R
q
•
P
D
4. The pins which are not defined may not be loaded by external signals
