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NCP3063DFBSTGEVB

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19
NCP3063, NCP3063B, NCV3063
http://onsemi.com
16
Figure 31. Typical Schematic of Buck Converter with RC Snubber and Pulse Feedback
IC1 NCP3063
5
36
4
8
7
1
2
R3
COMP
TC
GND
N.C. SWC
SWE
V
CC
I
PK
C1
0V 0V
C4
C2
R5
22k
R2
R1
L1
D1C3
R4
4n7
10R
In some cases where there are oscillations on the output
due to the input/output combination, output load variations
or PCB layout a snubber circuit on the SWE Pin will help
minimize the oscillation. Typical usage is shown in the
Figure 31. C3 values can be selected between 2.2 nF and
6.8 nF and R4 can be from 10 W to 22 W.
ORDERING INFORMATION
Device Package Shipping
†
NCP3063PG PDIP−8
(Pb−Free)
50 Units / Rail
NCP3063BPG PDIP−8
(Pb−Free)
50 Units / Rail
NCP3063BMNTXG DFN−8
(Pb−Free)
4000 / Tape & Reel
NCP3063DR2G SOIC−8
(Pb−Free)
2500 / Tape & Reel
NCP3063BDR2G SOIC−8
(Pb−Free)
2500 / Tape & Reel
NCP3063MNTXG DFN−8
(Pb−Free)
4000 / Tape & Reel
NCV3063PG PDIP−8
(Pb−Free)
50 Units / Rail
NCV3063DR2G SOIC−8
(Pb−Free)
2500 / Tape & Reel
NCV3063MNTXG DFN−8
(Pb−Free)
4000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCV prefix is for automotive and other applications requiring site and change control.
NCP3063, NCP3063B, NCV3063
http://onsemi.com
17
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AJ
SEATING
PLANE
1
4
58
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) Z
S
X
S
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒ
mm
inches
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NCP3063, NCP3063B, NCV3063
http://onsemi.com
18
PACKAGE DIMENSIONS
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
STYLE 1:
PIN 1. AC IN
2. DC + IN
3. DC - IN
4. AC IN
5. GROUND
6. OUTPUT
7. AUXILIARY
8. V
CC
14
58
F
NOTE 2
−A−
−B−
−T−
SEATING
PLANE
H
J
G
D
K
N
C
L
M
M
A
M
0.13 (0.005) B
M
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
G 2.54 BSC 0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L 7.62 BSC 0.300 BSC
M --- 10 --- 10
N 0.76 1.01 0.030 0.040
__
8 LEAD PDIP
CASE 626−05
ISSUE L
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19

NCP3063DFBSTGEVB

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Manufacturer:
ON Semiconductor
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Lifecycle:
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