MC74VHCT257AMEL Datasheet MC74VHCT257ADR2, MC74VHCT257AMELG, MC74VHCT257AMEL | P4-P6

MC74VHCT257A

http://onsemi.com

4

DC CHARACTERISTICS (Voltages Referenced to GND)

V

CC

T

A

= 25°C T

A

≤ 85°C −55°C ≤ T

A

≤ 125°C

Symbol Parameter Condition (V) Min Typ Max Min Max Min Max Unit

V

IH

Minimum High−Level

Input Voltage

4.5 to 5.5 2 2 2 V

V

IL

Maximum Low−Level

Input Voltage

4.5 to 5.5 0.8 0.8 0.8 V

V

OH

Maximum High−Level

Output Voltage

V

IN

= V

IH

or V

IL

I

OH

= −50 mA

4.5 3.94 3.8 3.66

V

IN

= V

IH

or V

IL

I

OH

= −8 mA 4.5 3.94 3.8 3.66

V

OL

Maximum Low−Level

Output Voltage

V

IN

= V

IH

or V

IL

I

OL

= 50 mA

4.5 0 0.1 0.1 0.1

V

IN

= V

IH

or V

IL

I

OH

= 8 mA 4.5 0.36 0.44 0.52

I

IN

Input Leakage Current V

IN

= 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 ±1.0

mA

I

OZ

Maximum 3−State

Leakage Current

V

IN

= V

IH

or V

IL

V

OUT

= V

CC

or GND

5.5 ±0.2

5

±2.5 ±2.5

mA

I

CCT

Maximum Quiescent

Supply Current

V

IN

= V

CC

or GND 5.5 1.35 1.5 1.65 mA

I

CC

Additional Quiescent

Supply Current (per pin)

V

IN

= V

CC

or GND 5.5 4.0 40 40

mA

I

OPD

Output Leakage Current V

OUT

= 5.5 V 0 0.5 5 5

mA

AC ELECTRICAL CHARACTERISTICS (Input t

r

= t

f

= 3.0ns)

Symbo

l

Parameter Test Conditions

T

A

= 25°C T

A

= ≤ 85°C −55°C ≤ T

A

≤ 125°C

Uni

t

Min Typ Max Min Max Min Max

t

PLH

,

t

PHL

Maximum Propagation

Delay, A or B to Y

V

CC

= 3.3 ± 0.3 V C

L

= 15 pF

C

L

= 50 pF

5.8

8.3

9.3

12.8

1.0

11.0

14.5

1.0

11.0

14.5

ns

V

CC

= 5.0 ± 0.5 V C

L

= 15 pF

C

L

= 50 pF

3.6

5.1

5.9

7.9

1.0

7.0

9.0

1.0

7.0

9.0

t

PLH

,

t

PHL

Maximum Propagation

Delay, S to Y

V

CC

= 3.3 ± 0.3 V C

L

= 15 pF

C

L

= 50 pF

7.0

9.5

11.0

14.5

1.0

13.0

16.5

1.0

13.0

16.5

ns

V

CC

= 5.0 ± 0.5 V C

L

= 15 pF

C

L

= 50 pF

4.0

5.5

6.8

8.8

1.0

8.0

10.0

1.0

8.0

10.0

t

PZL

,

t

PZH

Maximum Output Enable,

Time, OE to Y

V

CC

= 3.3 ± 0.3 V C

L

= 15 pF

R

L

= 1 kW C

L

= 50 pF

6.7

9.2

10.5

14.0

1.0

12.5

16.0

1.0

12.5

16.0

ns

V

CC

= 5.0 ± 0.5 V C

L

= 15 pF

R

L

= 1 kW C

L

= 50 pF

3.6

5.1

6.8

11.0

1.0

12.0

8.0

10.0

1.0

8.0

12.0

t

PLZ

,

t

PHZ

Maximum Output Disable,

Time, OE to Y

V

CC

= 3.3 ± 0.3 V C

L

= 50 pF

R

L

= 1 kW

10.5 14.0 1.0 15.0 1.0 15.0

ns

V

CC

= 5.0 ± 0.5 V C

L

= 50 pF

R

L

= 1 kW

9.5 12.0 1.0 13.0 1.0 13.0

C

IN

Maximum Input Capacitance 4 10 10 10 pF

C

PD

Power Dissipation Capacitance (Note 5)

Typical @ 25°C, V

CC

= 5.0 V

pF

20

5. C

PD

is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: I

CC(OPR

)

= C

PD

 V

CC

 f

in

+ I

CC

. C

PD

is used to determine the no−load dynamic

power consumption; P

D

= C

PD

 V

CC

2

 f

in

+ I

CC

 V

CC

.

NOISE CHARACTERISTICS (Input t

r

= t

f

= 3.0 ns, C

L

= 50 pF, V

CC

= 5.0 V)

Symbo

l

Characteristic

T

A

= 25°C

Uni

t

Typ Max

V

OLP

Quiet Output Maximum Dynamic V

OL

0.3 0.8 V

V

OLV

Quiet Output Minimum Dynamic V

OL

− 0.3 − 0.8 V

V

IHD

Minimum High Level Dynamic Input Voltage 2.0 V

V

ILD

Maximum Low Level Dynamic Input Voltage 0.8 V

MC74VHCT257A

http://onsemi.com

5

A, B or S

Figure 5. Switching Waveform Figure 6. Switching Waveform

Figure 7. Test Circuit

V

CC

GND

Y

t

PHL

t

PLH

50%

50% V

CC

Figure 8. Test Circuit

INPUT

*Includes all probe and jig capacitance

OUTPUT

TEST POINT

C

L

*

1 kW

CONNECT TO V

CC

WHEN

TESTING t

PLZ

AND t

PZL.

CONNECT TO GND WHEN

TESTING t

PHZ

AND t

PZH.

DEVICE

UNDER

TEST

Figure 9. Input Equivalent Circuit

*Includes all probe and jig capacitance

C

L

*

TEST POINT

DEVICE

UNDER

TEST

OUTPUT

50%

50% V

CC

50% V

CC

V

CC

GND

HIGH

IMPEDANCE

V

OL

+ 0.3V

V

OH

− 0.3V

Y

OE

t

PZL

t

PLZ

t

PZH

t

PHZ

HIGH

IMPEDANCE

ORDERING INFORMATION

Device Package Shipping

†

MC74VHCT257AD SOIC−16 48 Units / Rail

MC74VHCT257ADG SOIC−16

(Pb−Free)

48 Units / Rail

MC74VHCT257ADR2 SOIC−16 2500 Tape & Reel

MC74VHCT257ADR2G SOIC−16

(Pb−Free)

2500 Tape & Reel

MC74VHCT257ADT TSSOP−16* 96 Units / Rail

MC74VHCT257ADTG TSSOP−16* 96 Units / Rail

MC74VHCT257ADTR2 TSSOP−16* 2500 Tape & Reel

MC74VHCT257ADTRG TSSOP−16* 2500 Tape & Reel

MC74VHCT257AM SOEIAJ−16 50 Units / Rail

MC74VHCT257AMG SOEIAJ−16

(Pb−Free)

50 Units / Rail

MC74VHCT257AMEL SOEIAJ−16 2000 Tape & Reel

MC74VHCT257AMELG SOEIAJ−16

(Pb−Free)

2000 Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*This package is inherently Pb−Free.

MC74VHCT257A

http://onsemi.com

6

PACKAGE DIMENSIONS

SOIC−16

D SUFFIX

CASE 751B−05

ISSUE J

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

18

16 9

SEATING

PLANE

F

J

M

R X 45

_

G

8 PLP

−B−

−A−

M

0.25 (0.010) B

S

−T−

D

K

C

16 PL

S

B

M

0.25 (0.010) A

S

T

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 9.80 10.00 0.386 0.393

B 3.80 4.00 0.150 0.157

C 1.35 1.75 0.054 0.068

D 0.35 0.49 0.014 0.019

F 0.40 1.25 0.016 0.049

G 1.27 BSC 0.050 BSC

J 0.19 0.25 0.008 0.009

K 0.10 0.25 0.004 0.009

M 0 7 0 7

P 5.80 6.20 0.229 0.244

R 0.25 0.50 0.010 0.019

____

TSSOP−16

DT SUFFIX

CASE 948F−01

ISSUE A

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 4.90 5.10 0.193 0.200

B 4.30 4.50 0.169 0.177

C −−− 1.20 −−− 0.047

D 0.05 0.15 0.002 0.006

F 0.50 0.75 0.020 0.030

G 0.65 BSC 0.026 BSC

H 0.18 0.28 0.007 0.011

J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L 6.40 BSC 0.252 BSC

M 0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH. PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

____

SECTION N−N

SEATING

PLANE

IDENT.

PIN 1

1

8

16

9

DETAIL E

J

J1

B

C

D

A

K

K1

H

G

DETAIL E

F

M

L

2X L/2

−U−

S

U0.15 (0.006) T

S

U0.15 (0.006) T

S

U

M

0.10 (0.004) V

S

T

0.10 (0.004)

−T−

−V−

−W−

0.25 (0.010)

16X REFK

N

MC74VHCT257AMEL

MC74VHCT257AMEL

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