HIP2103, HIP2104
19
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FN8276.0
November 27, 2013
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• Large power components (Power FETs, Electrolytic caps, power
resistors, etc.) have internal parasitic inductance which cannot
be eliminated. This must be accounted for in the PCB layout
and circuit design.
• If you simulate your circuits, consider including parasitic
components especially parasitic inductance.
General EPAD Heatsinking
Considerations
The EPAD of the HIP2103, HIP2104 is electrically connected to
VSS through the IC substrate. The epad has two main functions:
to provide a quiet signal ground and to provide heat sinking for
the IC. The EPAD must be connected to a ground plane and
switching currents from the driven FETs should not pass through
the ground plane under the IC.
Figure 28 is a PCB layout example of how to use vias to remove
heat from the IC through the EPAD.
For maximum heatsinking, it is recommended that a ground
plane, connected to the EPAD, be added to both sides of the PCB.
A via array, within the area of the EPAD, will conduct heat from
the EPAD to the GND plane on the bottom layer. The number of
vias and the size of the GND planes required for adequate
heatsinking is determined by the power dissipated by the
HIP2103, HIP2104, the air flow, and the maximum temperature
of the air around the IC.
Note that a separate plane is added under the high side drive
circuits and is connected to HS. In a manner similar to the ground
plane, the HS plane provides the lowest possible parasitic
inductance for the HO/HS gate drive current loop.
See AN1899
“HIP2103, HIP2104 3-phase, Full, or Half Bridge
Motor Driver” for an example of PCB layout of a real application.
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VDD
EPAD GND
PLANE
COMPONENT
LAYER
HI
LI
LS
HB
HO
HS
LO
EPAD GND
PLANE
BOTTOM
LAYER
VDD
HI
LI
LS
HB
HO
HS
LO
This plane is
connected to
HS and is under
all high side
driver circuits
FIGURE 28. TYPICAL PCB PATTERN FOR THERMAL VIAS
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE REVISION CHANGE
November 27, 2013 FN8276.0 Initial Release
