MC74VHCT157ADTR2

© Semiconductor Components Industries, LLC, 2005
December, 2005 − Rev. 2
1 Publication Order Number:
MC74VHCT157A/D
MC74VHCT157A
Quad 2−Channel Multiplexer
The MC74VHCT157A is an advanced high speed CMOS quad
2−channel multiplexer fabricated with silicon gate CMOS technology.
It achieves high speed operation similar to equivalent Bipolar
Schottky TTL while maintaining CMOS low power dissipation.
It consists of four 2−input digital multiplexers with common select
(S) and enable (E) inputs. When E is held High, selection of data is
inhibited and all the outputs go Low.
The select decoding determines whether the A or B inputs get routed
to the corresponding Y outputs.
The VHCT inputs are compatible with TTL levels. This device can
be used as a level converter for interfacing 3.3 V to 5.0 V because it
has full 5.0 V CMOS level output swings.
The VHCT157A input structures provide protection when voltages
between 0 V and 5.5 V are applied, regardless of the supply voltage.
The output structures also provide protection when V
CC
= 0 V. These
input and output structures help prevent device destruction caused by
supply voltage−input/output voltage mismatch, battery backup, hot
insertion, etc.
The inputs tolerate voltages up to 7.0 V, allowing the interface of
5.0 V systems to 3.0 V systems.
Features
High Speed: t
PD
= 4.1 ns (Typ) at V
CC
= 5.0 V
Low Power Dissipation: I
CC
= 4 mA (Max) at T
A
= 25°C
TTL−Compatible Inputs: V
IL
= 0.8 V; V
IH
= 2.0 V
Power Down Protection Provided on Inputs and Outputs
Balanced Propagation Delays
Designed for 2.0 V to 5.5 V Operating Range
Low Noise: V
OLP
= 0.8 V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300 mA
ESD Performance:
Human Body Model > 2000 V;
Machine Model > 200 V
Chip Complexity: 82 FETs or 20 Equivalent Gates
Pb−Free Packages are Available*
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
MARKING
DIAGRAMS
TSSOP−16
DT SUFFIX
CASE 948F
SOIC−16
D SUFFIX
CASE 751B
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
http://onsemi.com
A = Assembly Location
WL, L = Wafer Lot
Y = Year
WW, W = Work Week
G or G = Pb−Free Package
VHCT157AG
AWLYWW
VHCT
157A
ALYWG
G
(Note: Microdot may be in either location)
1
1
16
1
1
16
1
SOEIAJ−16
M SUFFIX
CASE 966
74VHCT157
ALYWG
1
16
FUNCTION TABLE
E S Y0 − Y3
A0 − A3, B0 − B3 = the levels of
the respective Data−Word Inputs.
H
L
L
X
L
H
L
A0A3
B0B3
Inputs
Outputs
MC74VHCT157A
http://onsemi.com
2
Figure 1. Pin Assignment
4
7
9
12
2
3
5
6
11
10
14
13
15
1
A0
B0
A1
B1
A2
B2
A3
B3
Y0
Y1
Y2
Y3
E
S
DATA
OUTPUTS
NIBBLE
INPUTS
3
E
S
A0
B0
A1
B1
A2
B2
2
5
6
11
10
14
13
12
9
7
4
Y0
MUX
Y1
Y2
Y3
EN
1
15
A3
B3
G1
1
1
Figure 2. Expanded Logic Diagram
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
S
Y0
B0
A0
Y1
B1
A1
GND
Y3
B3
A3
E
V
CC
B2
A2
Y2
Figure 3. IEC Logic Symbol
This device contains protection circuitry to
guard against damage due to high static
voltages or electric fields. However, pre-
cautions must be taken to avoid applications
of any voltage higher than maximum rated
voltages to this high−impedance circuit. For
proper operation, V
in
and V
out
should be
constrained to the range GND v (V
in
or V
out
)
v V
CC
.
Unused inputs must always be tied to an
appropriate logic voltage level (e.g., either
GND or V
CC
). Unused outputs must be left
open.
MC74VHCT157A
http://onsemi.com
3
MAXIMUM RATINGS (Note 1)
Symbol Parameter Value Unit
V
CC
Positive DC Supply Voltage −0.5 to +7.0 V
V
IN
Digital Input Voltage −0.5 to +7.0 V
V
OUT
DC Output Voltage Output in 3−State
High or Low State
−0.5 to +7.0
−0.5 to V
CC
+0.5
V
I
IK
Input Diode Current −20 mA
I
OK
Output Diode Current $20 mA
I
OUT
DC Output Current, per Pin $25 mA
I
CC
DC Supply Current, V
CC
and GND Pins $75 mA
P
D
Power Dissipation in Still Air SOIC Package
TSSOP
200
180
mW
T
STG
Storage Temperature Range −65 to +150 °C
V
ESD
ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
>2000
>200
>2000
V
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 125°C (Note 5) $300 mA
q
JA
Thermal Resistance, Junction−to−Ambient SOIC Package
TSSOP
143
164
°C/W
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the
Recommended Operating Conditions.
2. Tested to EIA/JESD22−A114−A
3. Tested to EIA/JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
V
CC
DC Supply Voltage 4.5 5.5 V
V
IN
DC Input Voltage 0 5.5 V
V
OUT
DC Output Voltage Output in 3−State
High or Low State
0 V
CC
V
T
A
Operating Temperature Range, all Package Types −55 125 °C
t
r
, t
f
Input Rise or Fall Time V
CC
= 5.0 V + 0.5 V 0 20 ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME TO
0.1% BOND FAILURES
Junction
Temperature °C Time, Hours Time, Years
80 1,032,200 117.8
90 419,300 47.9
100 178,700 20.4
110 79,600 9.4
120 37,000 4.2
130 17,800 2.0
140 8,900 1.0
1
1 10 100
1000
TIME, YEARS
NORMALIZED FAILURE RATE
T
J
= 80
C°
T
J
= 90
C°
T
J
= 100 C°
T
J
= 110 C°
T
J
= 130 C°
T
J
= 120 C°
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 4. Failure Rate vs. Time Junction Temperature

MC74VHCT157ADTR2

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Encoders, Decoders, Multiplexers & Demultiplexers LOG CMOS QUAD 2-CHAN MULT
Lifecycle:
New from this manufacturer.
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