MC74VHCT157ADTR2

MC74VHCT157A
http://onsemi.com
4
DC CHARACTERISTICS (Voltages Referenced to GND)
V
CC
T
A
= 25°C T
A
85°C −55°C T
A
125°C
Symbol Parameter Condition (V) Min Typ Max Min Max Min Max Unit
V
IH
Minimum High−Level Input
Voltage
4.5 to
5.5
2 2 0.8 2 V
V
IL
Maximum Low−Level Input
Voltage
4.5 to
5.5
0.8 0.8 0.8 V
V
OH
Maximum High−Level Output
Voltage
V
IN
= V
IH
or V
IL
I
OH
= −50 mA
4.5 4.4 4.5 4.4 4.4
V
V
IN
= V
IH
or V
IL
I
OH
= −8 mA 4.5 3.94 3.8 3.66
V
OL
Maximum Low−Level Output
Voltage
V
IN
= V
IH
or V
IL
I
OL
= 50 mA
4.5 0.0 0.1 0.1 0.1
V
V
IN
= V
IH
or V
IL
I
OH
= 8 mA 4.5 0.36 0.44 0.52
I
IN
Input Leakage Current V
IN
= 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 ±1.0
mA
I
CC
Maximum Quiescent Supply
Current
V
IN
= V
CC
or GND 5.5 4.0 40.0 40.0
mA
I
CCT
Additional Quiescent Supply
Current (per Pin)
Any one input:
V
IN
= 3.4 V
All other inputs:
V
IN
= V
CC
or GND
5.5 1.35 1.5 1.5
mA
I
OPD
Output Leakage Current V
OUT
= 5.5 V 0 0.5 5 5
mA
AC ELECTRICAL CHARACTERISTICS (Input t
r
= t
f
= 3.0ns)
Symbo
l
Parameter Test Conditions
T
A
= 25°C T
A
= 85°C
−55°C T
A
125°C
Uni
t
Min Typ Max Min Max Min Max
t
PLH
,
t
PHL
Maximum Propagation Delay
;
A to B to Y
V
CC
= 3.3 ± 0.3 V C
L
= 15pF
C
L
= 50pF
5.6
8.0
7.0
10.0
1.0
1.0
7.7
11.0
1.0
1.0
7.7
11.0
ns
V
CC
= 5.0 ± 0.5 V C
L
= 15pF
C
L
= 50pF
4.1
5.6
6.4
8.4
1.0
1.0
7.5
9.5
1.0
1.0
7.5
9.5
t
PLH
,
t
PHL
Maximum Propagation Delay
;
S to Y
V
CC
= 3.3 ± 0.3 V C
L
= 15pF
C
L
= 50pF
6.1
8.5
7.5
10.5
1.0
1.0
8.2
11.5
1.0
1.0
8.2
11.5
ns
V
CC
= 5.0 ± 0.5 V C
L
= 15pF
C
L
= 50pF
5.3
6.8
8.1
10.1
1.0
1.0
9.5
11.5
1.0
1.0
9.5
11.5
t
PLH
,
t
PHL
Maximum Propagation Delay
;
E to Y
V
CC
= 3.3 ± 0.3 V C
L
= 15pF
C
L
= 50pF
6.1
8.5
7.5
10.5
1.0
1.0
8.2
11.5
1.0
1.0
8.2
11.5
ns
V
CC
= 5.0 ± 0.5 V C
L
= 15pF
C
L
= 50pF
5.6
7.1
8.6
10.6
1.0
1.0
10.0
12.0
1.0
1.0
10.0
12.0
C
IN
Maximum Input Capacitance 4 10 10 10 pF
C
PD
Power Dissipation Capacitance (Note 6)
Typical @ 25°C, V
CC
= 5.0 V
pF
20
6. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC
2
f
in
+ I
CC
V
CC
.
NOISE CHARACTERISTICS (Input t
r
= t
f
= 3.0ns, C
L
= 50pF, V
CC
= 5.0 V)
Symbo
l
Characteristic
T
A
= 25°C
Uni
t
Typ Max
V
OLP
Quiet Output Maximum Dynamic V
OL
0.3 0.8 V
V
OLV
Quiet Output Minimum Dynamic V
OL
− 0.3 − 0.8 V
V
IHD
Minimum High Level Dynamic Input Voltage 2.0 V
V
ILD
Maximum Low Level Dynamic Input Voltage 0.8 V
MC74VHCT157A
http://onsemi.com
5
A, B or S
Figure 5. Switching Waveform
Figure 6. Inverting Switching
Figure 7. Test Circuit
V
CC
GND
Y
t
PHL
t
PLH
50%
50% V
CC
INPUT
Figure 8. Input Equivalent Circuit
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
A, B or S
V
CC
GND
Y
t
PHL
t
PLH
50%
50% V
CC
ORDERING INFORMATION
Device Package Shipping
MC74VHCT157AD SOIC−16 48 Units / Rail
MC74VHCT157ADG SOIC−16
(Pb−Free)
48 Units / Rail
MC74VHCT157ADR2 SOIC−16 2500 Tape & Reel
MC74VHCT157ADR2G SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74VHCT157ADT TSSOP−16* 96 Units / Rail
MC74VHCT157ADTG TSSOP−16* 96 Units / Rail
MC74VHCT157ADTR2 TSSOP−16* 2500 Tape & Reel
M74VHCT157ADTR2G TSSOP−16* 2500 Tape & Reel
MC74VHCT157AM SOEIAJ−16 50 Units / Rail
MC74VHCT157AMG SOEIAJ−16
(Pb−Free)
50 Units / Rail
MC74VHCT157AMEL SOEIAJ−16 2000 Tape & Reel
MC74VHCT157AMELG SOEIAJ−16
(Pb−Free)
2000 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
MC74VHCT157A
http://onsemi.com
6
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R X 45
_
G
8 PLP
−B−
−A−
M
0.25 (0.010) B
S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
____
TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N

MC74VHCT157ADTR2

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Encoders, Decoders, Multiplexers & Demultiplexers LOG CMOS QUAD 2-CHAN MULT
Lifecycle:
New from this manufacturer.
Delivery:
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