MC10EP17, MC100EP17
www.onsemi.com
11
PACKAGE DIMENSIONS
ÏÏ
ÏÏ
QFN20, 4x4, 0.5P
CASE 485E*01
ISSUE B
2.88
20X
0.35
20X
0.58
4.30
0.50
DIMENSIONS: MILLIMETERS
1
SOLDERING FOOTPRINT*
PITCH
PKG
OUTLINE
DIM MINMAX
MILLIMETERS
D 4.00 BSC
E 4.00 BSC
A 0.801.00
b 0.200.30
e 0.50 BSC
L1 0.000.15
A3 0.20 REF
A1 ---0.05
L 0.350.45
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
D2
E2
1
6
11
20
D2
2.602.90
E2 2.602.90
e
L1
DETAIL A
L
ÏÏ
ÏÏ
OPTIONAL CONSTRUCTIONS
ÎÎ
A1
A3
L
ÎÎ
ÎÎ
ÏÏ
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL CONSTRUCTIONS
A
B
E
D
2X
0.15 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.15 C
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
DETAIL B
BOTTOM VIEW
b
20X
0.10 B
0.05
AC
C
NOTE 3
DETAIL A
K 0.20 REF
0.10 BAC
L20X
0.10 BAC
K
4.30
2.88
*For additional information on our Pb-Free strategy
and soldering details, please download the ON Semi-
conductor Soldering and Mounting Techniques Re-
ference Manual, SOLDERRM/D
.
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