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AXH003A0XZ

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
GE
Data Sheet
Austin MiniLynx
TM
: SIP Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
13
Feature Descriptions (continued)
Output Voltage Programming
The output voltage of the Austin MiniLynx
TM
SIP can be
programmed to any voltage from 0.75 Vdc to 3.63 Vdc by
connecting a single resistor (shown as Rtrim in Figure 32)
between the TRIM and GND pins of the module. Without an
external resistor between TRIM pin and the ground, the output
voltage of the module is 0.7525 Vdc. To calculate the value of
the resistor Rtrim for a particular output voltage Vo, use the
following equation:
Ω
−
−
= 5110
7525.0
21070
Vo
Rtrim
For example, to program the output voltage of the Austin
MiniLynx
TM
module to 1.8 Vdc, Rtrim is calculated is follows:
−
−
= 5110
7525
.08.
1
21070
Rtrim
Ω
= kRtrim 004.
15
V
O
(+)
TRIM
GND
R
trim
LOAD
V
IN
(+)
ON/OFF
Figure 32. Circuit configuration to program output voltage
using an external resistor.
Table 1 provides Rtrim values required for some common
output voltages.
Table 1
V
O, set
(V)
Rtrim (KΩ)
0.7525
Open
1.2
41.973
1.5
23.077
1.8
15.004
2.5
6.947
3.3
3.160
By using a 1% tolerance trim resistor, set point tolerance of
±2% is achieved as specified in the electrical specification. The
POL Programming Tool, available at www.gecriticalpower.com
under the Design Tools section, helps determine the required
external trim resistor needed for a specific output voltage.
Voltage Margining
Output voltage margining can be implemented in the Austin
MiniLynx
TM
modules by connecting a resistor, R
margin-up
, from
the Trim pin to the ground pin for margining-up the output
voltage and by connecting a resistor, R
margin-down
, from the Trim
pin to the Output pin for margining-down. Figure 33 shows the
circuit configuration for output voltage margining. The POL
Programming Tool, available at ww.gecriticalpower.com under
the Design Tools section, also calculates the values of R
margin-up
and R
margin-down
for a specific output voltage and % margin.
Please consult your local GE technical representative for
additional details.
Vo
Austin Lynx or
Lynx II Series
GND
Trim
Q1
Rtrim
Rmargin-up
Q2
Rmargin-down
Figure 33. Circuit Configuration for margining Output
voltage.
GE
Data Sheet
Austin MiniLynx
TM
: SIP Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
14
Thermal Considerations
Power modules operate in a variety of thermal environments;
however, sufficient cooling should always be provided to help
ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability. The thermal data presented
here is based on physical measurements taken in a wind
tunnel. The test set-up is shown in Figure 35. Note that the
airflow is parallel to the long axis of the module as shown in
figure 34. The derating data applies to airflow in either
direction of the module’s long axis.
Figure 34. T
ref
Temperature measurement location.
The thermal reference point, T
ref
used in the specifications is
shown in Figure 34. For reliable operation this temperature
should not exceed 115
o
C.
The output power of the module should not exceed the rated
power of the module (Vo,set x Io,max).
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
Figure 35. Thermal Test Set-up.
Air
flow
x
Power Module
Wind Tunnel
PWBs
5.97_
(0.235)
76.2_
(3.0)
Probe Location
for measuring
airflow and
ambient
temperature
25.4_
(1.0)
GE
Data Sheet
Austin MiniLynx
TM
: SIP Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
15
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual wave
soldering machines. The pins have an RoHS-compliant finish
that is compatible with both Pb and Pb-free wave soldering
processes. A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the temperature of
the power module board is kept below 210°C. For Pb solder,
the recommended pot temperature is 260°C, while the Pb-free
solder pot is 270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole Pb or Pb-
free reflow process. If additional information is needed, please
consult with your GE technical representative for more details.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

AXH003A0XZ

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Description:
Non-Isolated DC/DC Converters 2.4-5.5Vin 3A SIP 0.75-3.63Vout
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