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B57127P100M301

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19
1.1.2 Wave soldering
Temperature characteristic at component terminal with dual wave soldering
2 Robustness of terminations
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feed-
throughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Tensile strength: Test Ua1:
Leads 0.50 < ∅ ≤0.80 mm = 10.0 N
0.80 < ∅ ≤1.25 mm = 20.0 N
Bending strength: Test Ub:
Two 90°-bends in opposite directions at a weight of 0.25 kg.
Torsional strength: Test Uc: severity 2
The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body.
The bending radius of the leads should be approx. 0.75 mm. Two torsions of
180° each (severity 2).
Inrush current limiters B57127P0***M301
ICLs P27
Page 13 of 19Please read Cautions and warnings and
Important notes at the end of this document.
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Twisting of leads
The twisting (torsion) by 180° of a lead bent by 90° is permissible at 6 mm from the bottom of the
thermistor body.
3 Sealing and potting
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
4 Cleaning
If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are
recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are
permissible.
5 Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature: 25 °C up to 45 °C
Max. relative humidity (without condensation):
<95%, maximum 30 days per annum
Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-
fied:
Leaded components: 24 months
Inrush current limiters B57127P0***M301
ICLs P27
Page 14 of 19Please read Cautions and warnings and
Important notes at the end of this document.
Cautions and warnings
General
See "Important notes" on page 2.
Storage
Store thermistors only in original packaging. Do not open the package before storage.
Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative
humidity ≤75% annual mean, maximum 95%, dew precipitation is inadmissible.
Avoid contamination of thermistors surface during storage, handling and processing.
Avoid storage of thermistor in harmful environments like corrosive gases (SO
x
, Cl etc).
Solder thermistors after shipment from EPCOS within the time specified:
Leaded components: 24 months
Handling
NTC inrush current limiters must not be dropped. Chip-offs must not be caused during handling
of NTC inrush current limiters.
Components must not be touched with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
In case of exposure of the NTC inrush current limiters to water, electrolytes or other aggressive
media, these media can penetrate the coating and reach the surface of the ceramic. Low-ohmic
or high-ohmic behavior may occur due to the formation of an electrolyte with metals
(silver/lead/tin from metallization or solder). Low-ohmic behavior is caused by electrochemical
migration, high-ohmic behavior by dissolving of the electrode. In either case, the functionality of
the NTC inrush current limiters can not be assured.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
Bending / twisting leads
A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from
the component head or housing. When bending ensure the wire is mechanically relieved at the
component head or housing. The bending radius should be at least 0.75 mm.
Twisting (torsion) by 180° of a lead bent by 90° is permissible at 6 mm from the bottom of the
thermistor body.
Soldering
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
Inrush current limiters B57127P0***M301
ICLs P27
Page 15 of 19Please read Cautions and warnings and
Important notes at the end of this document.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19

B57127P100M301

Mfr. #:
Buy B57127P100M301
Manufacturer:
EPCOS / TDK
Description:
NTC THERMISTOR P27/10 /M
Lifecycle:
New from this manufacturer.
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