PCA9512A_PCA9512B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6 — 1 March 2013 22 of 27
NXP Semiconductors
PCA9512A; PCA9512B
Level shifting hot swappable I
2
C-bus and SMBus bus buffer
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Soldering: PCB footprints
MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Fig 19. PCB footprint for SOT96-1 (SO8); reflow soldering
sot096-1_fr
occupied area
solder lands
Dimensions in mm
placement accuracy ± 0.25
1.30
0.60 (8×)
1.27 (6×)
4.00 6.60
5.50
7.00
PCA9512A_PCA9512B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6 — 1 March 2013 23 of 27
NXP Semiconductors
PCA9512A; PCA9512B
Level shifting hot swappable I
2
C-bus and SMBus bus buffer
Fig 20. PCB footprint for SOT96-1 (SO8); wave soldering
Fig 21. PCB footprint for SOT505-1 (TSSOP8); reflow soldering
sot096-1_fw
solder resist
occupied area
solder lands
Dimensions in mm
board direction
placement accurracy ± 0.25
4.00
5.50
1.30
0.3 (2×)
0.60 (6×)
1.20 (2×)
1.27 (6×)
7.00
6.60
enlarged solder land
sot505-1_fr
occupied areasolder lands
Dimensions in mm
3.200
3.600
5.750
0.725
0.650
0.125
0.4500.600
3.600
2.950
0.125
1.150
5.500
PCA9512A_PCA9512B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6 — 1 March 2013 24 of 27
NXP Semiconductors
PCA9512A; PCA9512B
Level shifting hot swappable I
2
C-bus and SMBus bus buffer
16. Abbreviations
17. Revision history
Table 9. Abbreviations
Acronym Description
AdvancedTCA Advanced Telecommunications Computing Architecture
AVL Approved Vendor List
CDM Charged-Device Model
CMOS Complementary Metal-Oxide Semiconductor
cPCI compact Peripheral Component Interface
ESD Electrostatic Discharge
FET Field-Effect Transistor
HBM Human Body Model
I
2
C-bus Inter-Integrated Circuit bus
IC Integrated Circuit
PCI Peripheral Component Interface
PICMG PCI Industrial Computer Manufacturers Group
SMBus System Management Bus
VME VERSAModule Eurocard
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCA9512A_PCA9512B v.6 20130301 Product data sheet - PCA9512A_PCA9512B v.5
Modifications:
Section 1 “General description: second paragraph re-written
Section 2 “Features and benefits: 11th bullet item: deleted “200 V MM per
JESD22-A115”
Added Section 5.1 “Ordering options
Figure 1 “Block diagram of PCA9512A/B: added “LEVEL SHIFTER” block
Section 8 “Functional description: added (new) second paragraph
Figure 10 “Typical application: changed type number from “PCA9512A/B” to
“PCA9512A”
Added Section 8.9 “Voltage level translator discussion
Added Section 8.10 “Limitations of the FET voltage level translator
Added Section 8.11 “Additional system compromises
Added Section 15 “Soldering: PCB footprints
PCA9512A_PCA9512B v.5 20110105 Product data sheet - PCA9512A v.4
PCA9512A v.4 20090819 Product data sheet - PCA9512A v.3
PCA9512A v.3 20090720 Product data sheet - PCA9512A v.2
PCA9512A v.2 20090528 Product data sheet - PCA9512A v.1
PCA9512A v.1 20051007 Product data sheet - -

PCA9512AD,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Buffers & Line Drivers LEVSHIFT I2C/SMBUS
Lifecycle:
New from this manufacturer.
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