NXP Semiconductors
BSS138AKA
60 V, single N-channel Trench MOSFET
BSS138AKA All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 29 April 2015 3 / 16
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
drain-source voltage - 60 V
V
GS
gate-source voltage
T
j
= 25 °C
-20 20 V
V
GS
= 10 V; T
amb
= 25 °C [1] - 200 mAI
D
drain current
V
GS
= 10 V; T
amb
= 100 °C [1] - 125 mA
I
DM
peak drain current T
amb
= 25 °C; single pulse; t
p
≤ 10 µs - 800 mA
[2] - 300 mWT
amb
= 25 °C
[1] - 360 mW
P
tot
total power dissipation
T
sp
= 25 °C - 1060 mW
T
j
junction temperature -55 150 °C
T
amb
ambient temperature -55 150 °C
T
stg
storage temperature -65 150 °C
Source-drain diode
I
S
source current T
amb
= 25 °C [1] - 200 mA
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm
2
.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
T
amb
(°C)
- 75 17512525 75- 25
017aaa001
40
80
120
P
der
(%)
0
Fig. 1. Normalized total power dissipation as a
function of ambient temperature
T
amb
(°C)
- 75 17512525 75- 25
017aaa002
40
80
120
I
der
(%)
0
Fig. 2. Normalized continuous drain current as a
function of ambient temperature
NXP Semiconductors
BSS138AKA
60 V, single N-channel Trench MOSFET
BSS138AKA All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 29 April 2015 4 / 16
aaa-006618
V
DS
(V)
10
-1
10
2
101
10
-1
10
-2
10
I
D
(A)
10
-3
100 µs
1 ms
10 ms
DC; T
sp
= 25 °C
DC; T
amb
= 25 °C;
drain mounting pad 1 cm
2
Limit R
DSon
= V
DS
/I
D
t
p
=
10 µs
I
DM
= single pulse
Fig. 3. Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-
source voltage
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
[1] - 350 400 K/WR
th(j-a)
thermal resistance
from junction to
ambient
in free air
[2] - 300 340 K/W
R
th(j-sp)
thermal resistance
from junction to solder
point
- - 115 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm
2
.
NXP Semiconductors
BSS138AKA
60 V, single N-channel Trench MOSFET
BSS138AKA All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 29 April 2015 5 / 16
017aaa661
t
p
(s)
10
-3
10
2
10
3
10110
-2
10
-1
10
2
10
3
Z
th(j-a)
(K/W)
10
duty cycle = 1
0.75
0.5
0.33
0.25
0.2
0.1
0.05
0.02
0.01
0
FR4 PCB, standard footprint
Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
017aaa662
t
p
(s)
10
-3
10
2
10
3
10110
-2
10
-1
10
2
10
3
Z
th(j-a)
(K/W)
10
duty cycle = 1
0.75
0.5
0.33
0.25
0.2
0.1
0.05
0.02
0.01
0
FR4 PCB, mounting pad for drain 1 cm
2
Fig. 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

BSS138AKAR

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET BSS138AKA/TO-236AB/REEL 7" Q3/
Lifecycle:
New from this manufacturer.
Delivery:
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