STTH1R06RL

Characteristics STTH1R06
4/9 Doc ID 10203 Rev 5
Figure 5. Relative variation of thermal
impedance junction to case vs
pulse duration (SMB)
Figure 6. Peak reverse recovery current vs
dI
F
/dt (typical values)
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
T
δ
=tp/T
tp
t (s)
p
Single pulse
δ
= 0.2
δ
= 0.1
δ
= 0.5
S = 1cm
2
I (A)
RM
0
1
2
3
4
5
6
7
8
9
0 50 100 150 200 250 300 350 400 450 500
I =0.5 x I
F F(AV)
I =0.25 x I
F F(AV)
I=I
F F(AV)
I =2 x I
F F(AV)
V =400V
T =125°C
R
j
dI /dt(A/µs)
F
Figure 7. Reverse recovery time versus dI
F
/dt
(typical values)
Figure 8. Reverse recovery charges versus
dI
F
/dt (typical values)
t (ns)
rr
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0 50 100 150 200 250 300 350 400 450 500
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
F F(AV)
V =400V
T =125°C
R
j
dI /dt(A/µs)
F
Q (nC)
rr
0
25
50
75
100
125
150
175
200
225
250
0 50 100 150 200 250 300 350 400 450 500
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
F F(AV)
dI /dt(A/µs)
F
V =400V
T =125°C
R
j
Figure 9. Reverse recovery softness factor
vs dI
F
/dt (typical values)
Figure 10. Relative variations of dynamic
parameters vs junction temperature
S factor
0
1
2
3
4
5
6
0 50 100 150 200 250 300 350 400 450 500
I=I
T =125°C
F F(AV)
j
V =400V
R
dI /dt(A/µs)
F
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
25 50 75 100 125
T (°C)
j
I=I
Reference: T =125°C
F F(AV)
j
V =400V
R
I
RM
Q
RR
S factor
STTH1R06 Characteristics
Doc ID 10203 Rev 5 5/9
Figure 11. Transient peak forward voltage vs
dI
F
/dt (typical values)
Figure 12. Forward recovery time vs dI
F
/dt
(typical values)
Figure 13. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 14. Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead
(epoxy FR4, Cu = 35 µm) (SMA)
V (V)
FP
0
5
10
15
20
25
0 20 40 60 80 100 120 140 160 180 200
dI /dt(A/µs)
F
I=I
T =125°C
F F(AV)
j
t (ns)
fr
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140 160 180 200
I=I
T =125°C
F F(AV)
j
V =1.1 x V max.
FR F
dI /dt(A/µs)
F
1
10
100
1 10 100 1000
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC
j
0
10
20
30
40
50
60
70
80
90
100
110
0
12
3
4
56
7
89
1
0
R (°C/W)
th(j-a)
S(cm²)
DO-41
Lleads = 10mm
SMB
(epoxy FR4, Cu = 35 µm) (DO-41, SMB)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S(cm²)
SMA
Package information STTH1R06
6/9 Doc ID 10203 Rev 5
2 Package information
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 16. Footprint (dimensions in mm)
Table 6. SMA dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
E
C
L
E1
D
A1
A2
b
2.63
(0.103)
5.43
(0.214)
1.4
1.64
(0.064)
1.4
(0.055) (0.055)

STTH1R06RL

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Rectifiers 1.0 Amp 600 Volt
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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