NCP367
www.onsemi.com
13
PACKAGE DIMENSIONS
DFN8, 2.0x2.2, 0.5P
CASE 506BP
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A B
E
D
D2
E2
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
C
K8X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
9X
A
A1
(A3)
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L8X
1
4
58
8X
0.28
2.50
1.15
1
0.45
0.50
PITCH
1.63
8X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN TYP
MILLIMETERS
0.80 ---
A1 0.00 ---
A3 0.20 REF
b 0.20 ---
D 2.00 BSC
D2 1.43 ---
E 2.20 BSC
1.05 ---
E2
e 0.50 BSC
0.20 0.22
K
0.25 ---
L
--- ---
L1
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL B
DETAIL A
NOTE 4
0.10 BAC
0.10 BAC
e/2
MAX
1.00
0.05
0.30
1.53
1.25
0.30
0.35
0.15
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