IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXGF25N250
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, Unless Otherwise Specified) Min. Typ. Max.
g
fs
I
C
= 50A, V
CE
= 10V, Note 1 16 26 S
I
C(ON)
V
GE
= 15V, V
CE
= 20V, Note 1 240 A
C
ies
2970 pF
C
oes
V
CE
= 25V, V
GE
= 0V, f = 1MHz 98 pF
C
res
36 pF
Q
g
75 nC
Q
ge
I
C
= 50A, V
GE
= 15V, V
CE
= 0.5 • V
CES
15 nC
Q
gc
30 nC
t
d(on)
68 ns
t
r
233 ns
t
d(off)
209 ns
t
f
200 ns
R
thJC
1.10 °C/W
R
thCS
0.15 °C/W
R
thJA
30 °C/W
Resistive Switching Times
I
C
= 50A, V
GE
= 15V
V
CE
= 1250V, R
G
= 5Ω
Notes: 1. Pulse Test, t < 300µs; Duty Cycle, d < 2%.
2. Device must be heatsunk for high temperature leakage current
measurements to avoid thermal runaway.
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
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