RT8023
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DS8023-03 March 2011www.richtek.com
2. I
2
R losses are calculated from the resistance of the
internal switches R
SW
and external inductor R
L
. In
continuous mode, the average output current flowing
through inductor L is chopped between the main switch
and the synchronous switch. Thus, the series resistance
looking into the LX pin is a function of both top and bottom
MOSFETs R
DS(ON)
and the duty cycle (DC) as follows :
R
SW
= R
DS(ON)TOP
x DC + R
DS(ON)BOT
x (1DC)
The R
DS(ON)
for both the top and bottom MOSFETs can be
obtained from the Typical Performance Characteristic
curves. Thus, to obtain I
2
R loss, simply add R
SW
to R
L
and multiply the result by the square of the average output
current.
Other losses including C
IN
and C
OUT
ESR dissipative
losses and inductor core losses generally account for less
than 2% of total losses.
Checking Transient Response
The regulator loop response can be checked by looking
at the load transient response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, V
OUT
immediately shifts by an amount
equal to ΔI
LOAD
(ESR) also begins to charge or discharge
C
OUT
generating a feedback error signal for the regulator
to return V
OUT
to its steady-state value. During this recovery
time, V
OUT
can be monitored for overshoot or ringing that
would indicate a stability problem.
For LDO Part
The external capacitors used with the RT8023 must be
carefully selected for regulator stability and performance
just like any low-dropout regulator.
Using a capacitor whose value is >1μF on the RT8023
input and the amount of capacitance can be increased
without limit. The input capacitor must be located at a
distance of not more than 1cm from the input pin of the IC
and returned to a clean analog ground. Any good quality
ceramic or tantalum can be used for this capacitor. The
capacitor with larger value and lower ESR (equivalent series
resistance) provides better PSRR and line-transient
response.
The output capacitor must meet both requirements for
minimum amount of capacitance and ESR in all LDO
applications. The RT8023 is designed specifically to work
with low ESR ceramic output capacitor for space-saving
and performance consideration.
Enable
The RT8023 goes into sleep mode when the EN pin is in
the logic low condition. The RT8023 has an EN pin to turn
on or turn off the regulator during this condition. When
the EN pin is in the logic high condition, the regulator will
be turned on. The typical supply current for the EN pin is
0.1μA. The EN pin may be directly tied to V
IN
to keep the
part on. The enable input is CMOS logic and can not be
left floating.
Current Limit
The RT8023 contains an independent current limiter to
monitor and control the pass transistor's gate voltage. The
part limits the two LDOs' current respectively as follows :
LDO1 : 700mA and LDO2 : 350mA (min.). The output can
be shorted to ground indefinitely without damaging the
part.
PGOOD
The power good output is an open-drain output. It is
designed essentially to work as a power-on reset generator
once the regulated voltage was up or a fault condition
occurs. The output of the power good drives to low when
a fault condition occurs. The power good output will be
driven back to up once the output reaches 90% of its
nominal value. The output voltage level will be drooped at
the fault condition including current limit, thermal shutdown
or shutdown and triggers the PGOOD detector to alarm a
fault condition.
Due to the shutdown mode condition, a fault condition
occurs by pulling up the PGOOD output low. And it will
sink a current from the open drain and the external power.
It is recommended to select a suitable pulling resistance
to achieve the goal of ideal power dissipation control.
PSRR
The power supply rejection ratio (PSRR) is defined as the
ability of a regulator to maintain its output voltage as its
power supply voltage is varied. The PSRR is found to be:
PSRR = 20 x log[ ΔV
OUT
/ΔV
IN
]
RT8023
17
DS8023-03 March 2011 www.richtek.com
Thermal Consideration
For continuous operation, do not exceed the maximum
operation junction temperature 125°C. The maximum
power dissipation depends on the thermal resistance of
IC package, PCB layout, the rate of surroundings airflow
and temperature difference between junction to ambient.
The maximum power dissipation can be calculated by
following formula :
P
D(MAX)
= (T
J(MAX)
T
A
)/θ
JA
Where T
J(MAX)
is the maximum operating junction
temperature 125°C, T
A
is the ambient temperature and the
θ
JA
is the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT8023, where T
J(MAX)
is the maximum junction
temperature of the die (125°C) and T
A
is the maximum
ambient temperature. The junction to ambient thermal
resistance
θ
JA
is layout dependent. For WQFN-24L 4x4 packages,
the thermal resistance θ
JA
is 52°C/W on the standard JEDC
51-7 four-layers thermal test board. The maximum power
dissipation at T
A
= 25°C can be calculated by following
formula :
P
D(MAX)
= (125°C 25°C) / 52°C/W = 1.923 for
WQFN-24L 4x4 packages.
The maximum power dissipation depends on operating
ambient temperature for fixed T
J(MAX)
and thermal resistance
θ
JA
For RT8023 packages, the Figure 6 of derating curves
allows the designer to see the effect of rising ambient
temperature of maximum power allowed.
Figure 3
Figure 4
Note : The temperature effect must be taken into
consideration for heavy load PSRR measuring.
Figure 5. The PSRR for the RT8023
How a PCB layout will affect the PSRR is shown as
Figure 3. If the FB is placed in parallel with the PGOOD
and EN, the output voltage will be interfered to result in a
bad PSRR performance that is shown as Figure 5.
For the layout as shown in Figure 4, the FB is separated
from the PGOOD and the EN. In this condition, there will
be less interference for the output voltage and it will lead
to a better PSRR performance.
As shown in Figure 5, if the FB is separated from the
PGOOD and EN and a GND path is added, then it will lead
to a better PSRR performance especially for high frequency
applications.
EN3
FB2
PGOOD2
FB3
PGOOD3
EN2
GND
GND
GND Path
GND Paht
VOUT
VOUT
EN3
FB2
PGOOD2
FB3
PGOOD3
EN2
GND
GND VOUT
VOUT
LDO1 PSRR
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10 100 1000 10000 100000 1000000
Frequency (Hz)
PSRR (dB)
V
OUT
= 1.5V, I
OUT
= 10mA
0.01 0.1 1 10 100 1000
(kHz)
Figure 3
Figure 4 without GND path
Figure 4 with GND path
RT8023
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DS8023-03 March 2011www.richtek.com
Layout Consideration
Follow the PCB layout guidelines for optimal performance
of RT 8023
` Please refer to the PSRR section for layout
improvement.
` Keep the traces of the main current paths as short and
wide as possible.
` Put the input capacitor as close as possible to the device
pins (VIN and GND).
` LX node is with high frequency voltage swing and should
be kept small area. Keep analog components away from
LX node to prevent stray capacitive noise pick-up.
` Connect feedback network behind the output capacitors.
Keep the loop area small. Place the feedback
components near the RT8023. For the LDO layout part,
put the output capacitor as close as possible to the
device pins. (VIN and GND).
` Connect all analog grounds to a command node and
then connect the command node to the power ground
behind the output capacitors.
Figure 7
V
IN3
V
IN1
V
OUT1
PGOOD1
VDD1
VIN1
VIN1
VIN1
PGND
FB3
PGOOD3
EN3
EN2
PGOOD2
FB2
VOUT2
NC
PHASE1
PHASE1
VIN2
NC VIN3
AGND
EN1
FB1
NC
VOUT3
1
2
3
4
5
6
7
21 20 19
18
17
16
15
8910 12
14
13
24 2223
11
PGND
25
V
OUT3
V
IN2
C1
C2
C3
C4
C5
C6
C7
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
L1
The resistive dividers R3, R4, R7,
R8, R9 and R10 must be located
as close to the FB pin as possible.
Input capacitors C3, C4 and output capacitors
C6, C7 must be located at a distance of not
more than 1cm from RT8023 to GND.
The PHASE1 trace must be
wide and short, keep sensitive
components away from this
trace.
Keep output capacitor
C5 near the IC.
Put input capacitor as
dose as possible to
V
IN1
and GND pins.
Figure 6. Derating Curves for RT8023 Packages
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0 25 50 75 100 125
Ambient Temperature (°C)
Maximum Power Dissipation (W)
WQFN-24L 4x4

RT8023GQW

Mfr. #:
Manufacturer:
Description:
IC REG TRPL BCK/LINEAR 24WQFN
Lifecycle:
New from this manufacturer.
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