P3PS550AH
http://onsemi.com
6
PACKAGE DIMENSIONS
WDFN8 2x2, 0.5P
CASE 511AQ−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
C
A
SEATING
PLANE
D
E
0.10 C
A3
A
A1
0.10 C
DIM
A
MIN
MILLIMETERS
0.70
A1 0.00
A3 0.20 REF
b 0.20
D 2.00 BSC
E 2.00 BSC
e 0.50 BSC
PIN ONE
REFERENCE
0.05 C
0.05 C
8X
A0.10 C
NOTE 3
L
e
b
B
4
5
8X
1
8
0.05 C
0.50
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.30
0.50
0.78
7X
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
0.35
PITCH
8X
0.80
0.05
0.30
0.60
MAX
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL
CONSTRUCTION
---
L1
0.15
B
TOP VIEW
SIDE VIEW
e/2
1
PACKAGE
OUTLINE
DETAIL B
DETAIL A
2X
2X
8X
RECOMMENDED
0.88
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