BUK9880-55,135

Philips Semiconductors Product specification
TrenchMOS transistor BUK9880-55
Logic level FET
GENERAL DESCRIPTION QUICK REFERENCE DATA
N-channel enhancement mode logic SYMBOL PARAMETER MAX. UNIT
level field-effect power transistor in a
plastic envelope suitable for surface V
DS
Drain-source voltage 55 V
mounting. The device features very I
D
Drain current 7.5 A
low on-state resistance and has P
tot
Total power dissipation 1.8 W
integral zener diodes giving ESD T
j
Junction temperature 150 ˚C
protection. It is intended for use in R
DS(ON)
Drain-source on-state 80 m
automotive and general purpose resistance V
GS
= 5 V
switching applications.
PINNING - SOT223 PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
1 gate
2 drain
3 source
4 drain (tab)
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
Drain-source voltage - - 55 V
V
DGR
Drain-gate voltage R
GS
= 20 k -55V
±V
GS
Gate-source voltage - - 10 V
I
D
Drain current (DC) T
sp
= 25 ˚C - 7.5 A
I
D
Drain current (DC) On PCB in Fig.2 - 3.5 A
T
amb
= 25 ˚C
I
D
Drain current (DC) On PCB in Fig.2 - 2.2 A
T
amb
= 100 ˚C
I
DM
Drain current (pulse peak value) T
sp
= 25 ˚C - 40 A
P
tot
Total power dissipation T
sp
= 25 ˚C - 8.3 W
P
tot
Total power dissipation On PCB in Fig.2 - 1.8 W
T
amb
= 25 ˚C
T
stg
, T
j
Storage & operating temperature - - 55 150 ˚C
ESD LIMITING VALUE
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
C
Electrostatic discharge capacitor Human body model - 2 kV
voltage (100 pF, 1.5 k)
d
g
s
4
1
23
April 1998 1 Rev 1.100
Philips Semiconductors Product specification
TrenchMOS transistor BUK9880-55
Logic level FET
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
R
th j-sp
From junction to solder point Mounted on any PCB 12 15 K/W
R
th j-amb
From junction to ambient Mounted on PCB of Fig.18 - 70 K/W
STATIC CHARACTERISTICS
T
j
= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
Drain-source breakdown V
GS
= 0 V; I
D
= 0.25 mA 55 - - V
voltage T
j
= -55˚C 50 - - V
V
GS(TO)
Gate threshold voltage V
DS
= V
GS
; I
D
= 1 mA 1.0 1.5 2.0 V
T
j
= 150˚C 0.6 - - V
T
j
= -55˚C - - 2.3 V
I
DSS
Zero gate voltage drain current V
DS
= 55 V; V
GS
= 0 V; - 0.05 10 µA
T
j
= 150˚C - - 100 µA
I
GSS
Gate source leakage current V
GS
= ±5 V - 0.02 1 µA
T
j
= 150˚C - - 5 µA
±V
(BR)GSS
Gate source breakdown voltage I
G
= ±1 mA 10 - - V
R
DS(ON)
Drain-source on-state V
GS
= 5 V; I
D
= 5 A - 65 80 m
resistance T
j
= 150˚C - - 148 m
DYNAMIC CHARACTERISTICS
T
mb
= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
g
fs
Forward transconductance V
DS
= 25 V; I
D
= 5 A; T
j
= 25˚C 4 8 - S
C
iss
Input capacitance V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz - 500 650 pF
C
oss
Output capacitance - 110 135 pF
C
rss
Feedback capacitance - 60 85 pF
t
d on
Turn-on delay time V
DD
= 30 V; I
D
= 7 A; - 10 15 ns
t
r
Turn-on rise time V
GS
= 5 V; R
G
= 10 ; - 30 50 ns
t
d off
Turn-off delay time - 30 45 ns
t
f
Turn-off fall time T
j
= 25˚C - 30 40 ns
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
T
j
= -55 to 175˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
DR
Continuous reverse drain T
sp
= 25˚C - - 7.5 A
current
I
DRM
Pulsed reverse drain current T
sp
= 25˚C - - 40 A
V
SD
Diode forward voltage I
F
= 5 A; V
GS
= 0 V - 0.85 1.1 V
t
rr
Reverse recovery time I
F
= 5 A; -dI
F
/dt = 100 A/µs; - 38 - ns
Q
rr
Reverse recovery charge V
GS
= -10 V; V
R
= 30 V - 0.2 - µC
April 1998 2 Rev 1.100
Philips Semiconductors Product specification
TrenchMOS transistor BUK9880-55
Logic level FET
AVALANCHE LIMITING VALUE
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
W
DSS
Drain-source non-repetitive I
D
= 2.5 A; V
DD
25 V; - - 30 mJ
unclamped inductive turn-off V
GS
= 5 V; R
GS
= 50 ; T
sp
= 25 ˚C
energy
Fig.1. Normalised power dissipation.
PD% = 100
P
D
/P
D 25 ˚C
= f(T
sp
)
Fig.2. Normalised continuous drain current.
ID% = 100
I
D
/I
D 25 ˚C
= f(T
sp
); conditions: V
GS
5 V
Fig.3. Safe operating area. T
sp
= 25 ˚C
I
D
& I
DM
= f(V
DS
); I
DM
single pulse; parameter t
p
Fig.4. Transient thermal impedance.
Z
th j-sp
= f(t); parameter D = t
p
/T
0 20 40 60 80 100 120 140
Tmb / C
PD%
Normalised Power Derating
120
110
100
90
80
70
60
50
40
30
20
10
0
1 10 100
0.1
1
10
100
VDS/V
RDS(ON) = VDS/ID
DC
ID/A
tp =
1 us
10us
100 us
1 ms
10ms
100ms
0 20 40 60 80 100 120 140
Tmb / C
ID%
Normalised Current Derating
120
110
100
90
80
70
60
50
40
30
20
10
0
1.0E-06 0.0001 0.01 1 100
0.01
0.1
1
10
100
Zth/ (K/W)
t/s
0.5
0.2
0.1
0.05
0.02
D =
t
p
t
p
T
T
P
t
D
April 1998 3 Rev 1.100

BUK9880-55,135

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET N-CH 55V 7.5A SOT223
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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