PZUXDB2_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 31 March 2008 3 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
[2] /DG: halogen-free plastic package
5. Limiting values
[1] t
p
= 100 µs; square wave; T
j
=25°C prior to surge
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
PZU10DB2 TF* PZU10DB2/DG UF*
PZU11DB2 TG* PZU11DB2/DG UG*
PZU12DB2 TH* PZU12DB2/DG UH*
PZU13DB2 TK* PZU13DB2/DG UK*
PZU14DB2 TL* PZU14DB2/DG UL*
PZU15DB2 TM* PZU15DB2/DG UM*
PZU16DB2 TN* PZU16DB2/DG UN*
PZU18DB2 TP* PZU18DB2/DG UP*
PZU20DB2 TR* PZU20DB2/DG UR*
PZU22DB2 TS* PZU22DB2/DG US*
PZU24DB2 TT* PZU24DB2/DG UT*
Table 4. Marking codes
…continued
Type number Marking code
[1]
Type number
[2]
Marking code
[1]
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
I
F
forward current - 200 mA
I
ZSM
non-repetitive peak reverse
current
[1]
- see
Table 8
P
ZSM
non-repetitive peak reverse
power dissipation
[1]
-40W
Per device
P
tot
total power dissipation T
amb
≤ 25 °C
[2]
- 250 mW
[3]
- 275 mW
T
j
junction temperature - 150 °C
T
amb
ambient temperature −55 +150 °C
T
stg
storage temperature −65 +150 °C