NSP8814, NSP8818
www.onsemi.com
9
PACKAGE DIMENSIONS
UDFN10 3.5x2, 0.575P
CASE 506CU
ISSUE O
DIM MIN MAX
MILLIMETERS
A
A1 0.00 0.05
A3
b 0.15 0.25
D 3.50 BSC
E 2.00 BSC
e 0.575 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
0.127 REF
b
L
PIN ONE
1
6
5
D
E
B
A
C0.10
C0.10
2X
2X
10
e
10X
13X
NOTE 3
A
NOTE 4
C
A1
(A3)
SEATING
PLANE
C0.05
C0.05
0.45 0.55
L 0.25 0.35
REFERENCE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
0.22
1.10
2.30
DIMENSIONS: MILLIMETERS
MOUNTING FOOTPRINT*
9X
1
RECOMMENDED
DETAIL A
BAC
C
M
0.10
M
0.05
L2
L1 0.05 0.15
DETAIL B
2X
0.40
PACKAGE
OUTLINE
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTION
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
A1
A3
13X
e2 0.40 BSC
e3 3.10 BSC
L2 0.95 1.05
e2
3X
e2
e
e3
3.50
0.40
0.50
8X
0.575
6X
0.31
2X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NSP8814/D
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