TSL2560, TSL2561
LIGHT-TO-DIGITAL CONVERTER
TAOS059N − MARCH 2009
33
The LUMENOLOGY r Company
r
r
Copyright E 2009, TAOS Inc.
www.taosinc.com
MECHANICAL DATA
PACKAGE TMB-6 Six-Lead Surface Mount Device
PIN 1
0.311.90
2.60
3.80
1.35
0.90 TYP
0.90
TYP
0.30
TYP
0.60
TYP
0.30
TYP
OP VIEW
BOTTOM VIEW
END VIEW
R 0.20
6 Pls
PIN 4
Lead Free
Pb
Photo-Active Area
TOP VIEW
0.50
0.88
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.20 mm unless otherwise noted.
B. The photo-active area is 1398 μm by 203 μm.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is 0.5 μm minimum of soft gold plated over a 18 μm thick copper foil pattern with a 5 μm to 9 μm nickel barrier.
E. The underside of the package includes copper traces used to connect the pads during package substrate fabrication. Accordingly,
exposed traces and vias should not be placed under the footprint of the TMB package in a PCB layout.
F. This package contains no lead (Pb).
G. This drawing is subject to change without notice.
Figure 24. Package T — Six-Lead TMB Plastic Surface Mount Packaging Configuration
