©2011 Silicon Storage Technology, Inc. DS25111A 12/11
2
32 Mbit Multi-Purpose Flash Plus
SST39VF3201B / SST39VF3202B
Data Sheet
Microchip Technology Company
Product Description
The SST39VF320xB devices are 2M x16 CMOS Multi-Purpose Flash Plus (MPF+) manufactured
with SST’s proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design
and thick-oxide tunneling injector attain better reliability and manufacturability compared with alter-
nate approaches. The SST39VF320xB write (Program or Erase) with a 2.7-3.6V power supply.
These devices conform to JEDEC standard pin assignments for x16 memories.
Featuring high performance Word-Program, the SST39VF320xB devices provide a typical Word-
Program time of 7 µsec. These devices use Toggle Bit or Data# Polling to indicate the completion
of Program operation. To protect against inadvertent write, they have on-chip hardware and Soft-
ware Data Protection schemes. Designed, manufactured, and tested for a wide spectrum of appli-
cations, these devices are offered with a guaranteed typical endurance of 100,000 cycles. Data
retention is rated at greater than 100 years.
The SST39VF320xB devices are suited for applications that require convenient and economical
updating of program, configuration, or data memory. For all system applications, they significantly
improve performance and reliability, while lowering power consumption. They inherently use less
energy during Erase and Program than alternative flash technologies. The total energy consumed
is a function of the applied voltage, current, and time of application. Since for any given voltage
range, the SuperFlash technology uses less current to program and has a shorter erase time, the
total energy consumed during any Erase or Program operation is less than alternative flash tech-
nologies. These devices also improve flexibility while lowering the cost for program, data, and con-
figuration storage applications.
The SuperFlash technology provides fixed Erase and Program times, independent of the number of
Erase/Program cycles that have occurred. Therefore the system software or hardware does not have
to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Pro-
gram times increase with accumulated Erase/Program cycles.
To meet high-density, surface mount requirements, the SST39VF320xB devices are offered in 48-lead
TSOP and 48-ball TFBGA packages. See Figure 2 and Figure 3 for pin assignments.
