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SST39VF3201B-70-4I-B3KE

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P34
©2011 Silicon Storage Technology, Inc. DS25111A 12/11
31
32 Mbit Multi-Purpose Flash Plus
SST39VF3201B / SST39VF3202B
Data Sheet
A
Microchip Technology Company
Product Ordering Information
Valid Combinations for SST39VF3201B
SST39VF3201B-70-4C-EKE SST39VF3201B-70-4C-B3KE
SST39VF3201B-70-4I-EKE SST39VF3201B-70-4I-B3KE
Valid Combinations for SST39VF3202B
SST39VF3202B-70-4C-EKE SST39VF3202B-70-4C-B3KE
SST39VF3202B-70-4I-EKE SST39VF3202B-70-4I-B3KE
Note:Valid combinations are those products in mass production or will be in mass production. Consult your SST
sales representative to confirm availability of valid combinations and to determine availability of new combi-
nations.
SST 39 VF 3201B - 70 - 4I - EKE
XX XX XXXXX - XX - XX
-
XXX
Environmental Attribute
E
1
= non-Pb
Package Modifier
K = 48 balls or leads
Package Type
E = TSOP (type1, die up, 12mm x 20mm)
B3 = TFBGA (6mm x 8mm, 0.8mm pitch)
Temperature Range
C = Commercial = 0°C to +70°C
I = Industrial = -40°C to +85°C
Minimum Endurance
4 = 10,000 cycles
Read Access Speed
70=70ns
Hardware Block Protection
1 = Bottom Boot-Block
2 = Top Boot-Block
Device Density
320= 32Mbit
Voltage
V = 2.7-3.6V
Product Series
39 = Multi-Purpose Flash Plus
1. Environmental suffix “E” denotes non-Pb solder.
SST non-Pb solder devices are “RoHS Compli-
ant”.
©2011 Silicon Storage Technology, Inc. DS25111A 12/11
32
32 Mbit Multi-Purpose Flash Plus
SST39VF3201B / SST39VF3202B
Data Sheet
A
Microchip Technology Company
Packaging Diagrams
Figure 26:48-lead Thin Small Outline Package (TSOP) 12mm x 20mm,
SST Package Code: EK
1.05
0.95
0.70
0.50
18.50
18.30
20.20
19.80
0.70
0.50
12.20
11.80
0.27
0.17
0.15
0.05
48-tsop-EK-8
Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
1.20
max.
1mm
0°- 5°
DETAIL
Pin # 1 Identifier
0.50
BSC
©2011 Silicon Storage Technology, Inc. DS25111A 12/11
33
32 Mbit Multi-Purpose Flash Plus
SST39VF3201B / SST39VF3202B
Data Sheet
A
Microchip Technology Company
Figure 27:48-ball Thin-profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm,
SST Package Code: B3K
A1 CORNER
HGFEDCBA
ABCDEFGH
BOTTOM VIEWTOP VIEW
SIDE VIEW
6
5
4
3
2
1
6
5
4
3
2
1
SEATING PLANE
0.35 0.05
1.10 0.10
0.12
6.00 0.10
0.45 0.05
(48X)
A1 CORNER
8.00 0.10
0.80
4.00
0.80
5.60
48-tfbga-B3K-6x8-450mic-5
Note: 1. Complies with JEDEC Publication 95, MO-210, variant AB-1 , although some dimensions may be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm ( 0.05 mm)
1mm
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P34

SST39VF3201B-70-4I-B3KE

Mfr. #:
Buy SST39VF3201B-70-4I-B3KE
Manufacturer:
Microchip Technology
Description:
NOR Flash 2.7 to 3.6V 32Mbit Multi-Purpose Flash
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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