AD8351SCPZ-EP-R7

AD8351-EP Enhanced Product
Rev. A | Page 4 of 12
Parameter Test Conditions/Comments Min Typ Max Unit
70 MHz
Second/Third Harmonic Distortion
2
R
L
= 1 kΩ, V
OUT
= 2 V p-p 79/81 dBc
R
L
= 150 Ω, V
OUT
= 2 V p-p 65/66 dBc
Third-Order IMD R
L
= 1 kΩ, f1 = 69.5 MHz, f2 = 70.5 MHz,
V
OUT
= 2 V p-p composite
85 dBc
R
L
= 150 Ω, f1 = 69.5 MHz, f2 = 70.5 MHz,
V
OUT
= 2 V p-p composite
69 dBc
Output Third-Order Intercept f1 = 69.5 MHz, f2 = 70.5 MHz 31 dBm
Noise Spectral Density (RTI) 2.70 nV/√Hz
1 dB Compression Point 13.3 dBm
140 MHz
Second/Third Harmonic Distortion
2
R
L
= 1 kΩ, V
OUT
= 2 V p-p 69/69 dBc
R
L
= 150 Ω, V
OUT
= 2 V p-p 54/53 dBc
Third-Order IMD R
L
= 1 kΩ, f1 = 139.5 MHz, f2 = 140.5 MHz,
V
OUT
= 2 V p-p composite
79 dBc
R
L
= 150 Ω, f1 = 139.5 MHz, f2 = 140.5 MHz,
V
OUT
= 2 V p-p composite
67 dBc
Output Third-Order Intercept f1 = 139.5 MHz, f2 = 140.5 MHz 29 dBm
Noise Spectral Density (RTI) 2.75 nV/√Hz
1 dB Compression Point 13 dBm
240 MHz
Second/Third Harmonic Distortion
2
R
L
= 1 kΩ, V
OUT
= 2 V p-p 60/66 dBc
R
L
= 150 Ω, V
OUT
= 2 V p-p 46/50 dBc
Third-Order IMD R
L
= 1 kΩ, f1 = 239.5 MHz, f2 = 240.5 MHz,
V
OUT
= 2 V p-p composite
76 dBc
R
L
= 150 Ω, f1 = 239.5 MHz, f2 = 240.5 MHz,
V
OUT
= 2 V p-p composite
62 dBc
Output Third-Order Intercept f1 = 239.5 MHz, f2 = 240.5 MHz 27 dBm
Noise Spectral Density (RTI) 2.90 nV/√Hz
1 dB Compression Point 13 dBm
1
Values are specified differentially.
2
See the AD8351 data sheet for information about single-ended to differential operation.
Enhanced Product AD8351-EP
Rev. A | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage, VPOS 6 V
PWUP Voltage VPOS
Internal Power Dissipation 320 mW
θ
JA
79.1°C/W
Maximum Junction Temperature 125°C
Operating Temperature Range 55°C to +105°C
Storage Temperature Range 65°C to +150°C
Lead Temperature Range (Soldering, 60 sec)
300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by this device
is limited by the associated rise in junction temperature.
Exceeding a junction temperature of 125°C for an extended
period can result in device failure.
To ensure proper operation of the AD8351-EP, it is necessary to
observe the maximum power derating curve (see Figure 2) to
guarantee that the maximum junction temperature (125°C) is
not exceeded under all conditions.
Figure 2. Maximum Power Dissipation vs. Temperature
ESD CAUTION
0.200
0.225
0.250
0.275
0.300
0.325
0.350
–60
–50
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
90
100
110
MAXIMUM POWER DISSIPATION (W)
AMBIENT TEMPERATURE (°C)
14821-002
AD8351-EP Enhanced Product
Rev. A | Page 6 of 12
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin No. Mnemonic Description
1
RGP1
Gain Resistor Input 1.
2 INHI Balanced Differential Input, High. Biased to midsupply, typically ac-coupled.
3 INLO Balanced Differential Input, Low. Biased to midsupply, typically ac-coupled.
4 RGP2 Gain Resistor Input 2.
5, 6, 7, 8, 14, 15 NC No Connect. Do not connect to this pin.
9 COMM Device Common. Connect this pin to a low impedance ground.
10 OPLO Balanced Differential Output, Low. Biased to VOCM, typically ac-coupled.
11 OPHI Balanced Differential Output, High. Biased to VOCM, typically ac-coupled.
12 VPOS Positive Supply Voltage. 3 V to 5.5 V.
13 VOCM Input/Output Common-Mode Voltage. The voltage applied to this pin sets the common-mode voltage at
both the input and output. This pin is typically decoupled to ground with a 0.1 µF capacitor.
16 PWUP Apply a positive voltage (1.3 V ≤ V
PWUP
VPOS) to activate the device.
EPAD Exposed Pad. The exposed pad is internally connected to GND and must be soldered to a low impedance
ground plane.
14821-003
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
2. THE EXPOSED PAD IS INTERNALLY CONNECTED TO
GND AND MUST BE SOLDERED TO A LOW
IMPEDANCE GROUND PLANE.
12
11
10
1
3
4
9
2
6
5
7
8
16
15
14
13
RGP1
INHI
INLO
RGP2
VPOS
VOCM
NC
NC
PWUP
OPHI
OPLO
COMM
NC
NC
NC
NC
AD8351-EP
TOP VIEW
(Not to Scale)

AD8351SCPZ-EP-R7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Amplifier EP LFCSP Package
Lifecycle:
New from this manufacturer.
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