NTP5411NG

NTB5411N, NTP5411N
http://onsemi.com
4
TYPICAL PERFORMANCE CURVES
0
1000
2000
3000
4000
5000
6000
7000
0 102030405060
V
DS
, DRAINTOSOURCE VOLTAGE (V)
Figure 7. Capacitance Variation
C, CAPACITANCE (pF)
V
GS
= 0 V
C
rss
C
oss
C
iss
T
J
= 25°C
1
10
100
1000
1 10 100
0
1
2
3
4
5
6
7
8
9
10
0 102030405060708090
Q
g
, TOTAL GATE CHARGE (nC)
V
GS
, GATETOSOURCE VOLTAGE (V)
Figure 8. GatetoSource Voltage vs. Total
Charge
V
DS
= 48 V
I
D
= 80 A
T
J
= 25°C
Q
T
Q
2
Q
1
t, TIME (ns)
R
G
, GATE RESISTANCE (W)
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
t
r
t
f
t
d(off)
t
d(on)
0
10
20
30
40
50
60
70
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
V
SD
, SOURCETODRAIN VOLTAGE (V)
I
S
, SOURCE CURRENT (A)
Figure 10. Diode Forward Voltage vs. Current
V
GS
= 0 V
T
J
= 25°C
V
DS
, DRAINTOSOURCE VOLTAGE (V)
I
D
, DRAIN CURRENT (A)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
0
50
100
150
200
250
300
25 50 75 100 125 150 175
T
J
, STARTING JUNCTION TEMPERATURE (°C)
AVALANCHE ENERGY (mJ)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
I
D
= 75 A
V
DD
= 48 V
I
D
= 80 A
V
GS
= 10 V
0.1
10
100
1000
0.1 10 100
10 ms
100 ms
1 ms
10 ms
dc
R
DS(on)
Limit
Thermal Limit
Package Limit
1
1
0 V V
GS
10 V
Single Pulse
T
C
= 25°C
NTB5411N, NTP5411N
http://onsemi.com
5
TYPICAL PERFORMANCE CURVES
0.001
0.01
0.1
1
10
100
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
t, PULSE TIME (s)
Figure 13. Thermal Response
r(t), (°C/W)
D = 0.5
0.2
0.1
0.05
0.02
0.01
SurfaceMounted on FR4 Board using 1 sq in pad size, 1 oz Cu
ORDERING INFORMATION
Device Package Shipping
NTP5411NG TO220AB
(PbFree)
50 Units / Rail
NTB5411NT4G D
2
PAK
(PbFree)
800 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NTB5411N, NTP5411N
http://onsemi.com
6
PACKAGE DIMENSIONS
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
SEATING
PLANE
S
G
D
T
M
0.13 (0.005) T
231
4
3 PL
K
J
H
V
E
C
A
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.340 0.380 8.64 9.65
B 0.380 0.405 9.65 10.29
C 0.160 0.190 4.06 4.83
D 0.020 0.035 0.51 0.89
E 0.045 0.055 1.14 1.40
G 0.100 BSC 2.54 BSC
H 0.080 0.110 2.03 2.79
J 0.018 0.025 0.46 0.64
K 0.090 0.110 2.29 2.79
S 0.575 0.625 14.60 15.88
V 0.045 0.055 1.14 1.40
B
M
B
W
W
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B01 THRU 418B03 OBSOLETE,
NEW STANDARD 418B04.
F 0.310 0.350 7.87 8.89
L 0.052 0.072 1.32 1.83
M 0.280 0.320 7.11 8.13
N 0.197 REF 5.00 REF
P 0.079 REF 2.00 REF
R 0.039 REF 0.99 REF
M
L
F
M
L
F
M
L
F
VARIABLE
CONFIGURATION
ZONE
R
N P
U
VIEW WW VIEW WW VIEW WW
123
D
2
PAK 3
CASE 418B04
ISSUE K
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.38
5.080
DIMENSIONS: MILLIMETERS
PITCH
2X
16.155
1.016
2X
10.49
3.504

NTP5411NG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET N-CH 60V 80A TO-220AB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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