ZXTP19060CZ
Issue 1- February 2008 2 www.zetex.com
© Zetex Semiconductors plc 2008
Absolute maximum ratings
Thermal resistance
NOTES:
(a) For a device surface mounted on 15mm x 15mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions.
(b) Mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
(c) Mounted on 50mm x 50mm x 0.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions.
(d) As (c) above measured at t<10 seconds.
(e) Junction to case (collector tab). Typical
Parameter Symbol Limit Unit
Collector-Base voltage V
CBO
-60 V
Collector-Emitter voltage V
CEO
-60 V
Emitter-Collector voltage (reverse blocking) V
ECX
-7 V
Emitter-Base voltage V
EBO
-7 V
Continuous Collector current
(c)
I
C
-4.5 A
Base current I
B
-1 A
Peak pulse current I
CM
-7 A
Power dissipation at T
A
=25°C
(a)
Linear derating factor
P
D
1.1
8.8
W
mW/°C
Power dissipation at T
A
=25°C
(b)
Linear derating factor
P
D
1.8
14.4
W
mW/°C
Power dissipation at T
A
=25°C
(c)
Linear derating factor
P
D
2.4
19.2
W
mW/°C
Power dissipation at T
A
=25°C
(d)
Linear derating factor
P
D
4.46
35.7
W
mW/°C
Power dissipation at T
C
=25°C
(e)
Linear derating factor
P
D
26.7
213
W
mW/°C
Operating and storage temperature range T
j
, T
stg
-55 to 150
°C
Parameter Symbol Limit Unit
Junction to ambient
(a)
R
UJA
117 °C/W
Junction to ambient
(b)
R
UJA
68 °C/W
Junction to ambient
(c)
R
UJA
51 °C/W
Junction to ambient
(d)
R
UJA
28 °C/W
Junction to case
(e)
R
UJC
4.69 °C/W
