REV.
–3–
ADP3331
Parameter Symbol Conditions Min Typ Max Unit
OUTPUT CURRENT IN I
OSD
T
A
= 25∞C @ V
IN
= 12 V 1 mA
SHUTDOWN MODE T
A
= 85∞C @ V
IN
= 12 V 2 mA
ERROR PIN OUTPUT LEAKAGE I
EL
V
EO
= 5 V 1 mA
ERROR PIN OUTPUT
LOW VOLTAGE V
EOL
I
SINK
= 400 mA 0.19 0.40 V
NOTES
1
Ambient temperature of 85∞C corresponds to a junction temperature of 125∞C under typical full load test conditions.
2
Application stable with no load.
3
Assumes the use of ideal resistors. Overall accuracy also depends on the tolerance of the external resistors used to set the output voltage.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
Input Supply Voltage . . . . . . . . . . . . . . . . . . . .–0.3 V to +16 V
Shutdown Input Voltage . . . . . . . . . . . . . . . . .–0.3 V to +16 V
Power Dissipation . . . . . . . . . . . . . . . . . . . . Internally Limited
Operating Ambient Temperature Range . . . . –40∞C to +85∞C
Operating Junction Temperature Range . . . –40∞C to +125∞C
q
JA
(4-Layer Board) . . . . . . . . . . . . . . . . . . . . . . . . 165∞C/W
q
JA
(2-Layer Board) . . . . . . . . . . . . . . . . . . . . . . . . 190∞C/W
Storage Temperature Range . . . . . . . . . . . . –65∞C to +150∞C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300∞C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215∞C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220∞C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADP3331 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
PIN CONFIGURATION
TOP VIEW
(Not to Scale)
6
5
4
1
2
3
GND
FB
SD
ERR
IN
OUT
ADP3331
PIN FUNCTION DESCRIPTIONS
Pin Name Function
1 OUT Output of the Regulator. Bypass to ground
with a 0.47 mF or larger capacitor.
2INRegulator Input.
3 ERR Open Collector Output that goes low to
indicate that the output is about to go out
of regulation.
4GND Ground.
5FBFeedback Input. Connect to an external
resistor divider, which sets the output
voltage.
6 SD Active Low Shutdown Pin. Connect to
ground to disable the regulator output.
When shutdown is not used, this pin
should be connected to the input pin.
