ADP3331ARTZ-REEL7

REV.
ADP3331
–6–
THEORY OF OPERATION
The ADP3331 anyCAP LDO uses a single control loop for both
regulation and reference functions, as shown in Figure 2. The
output voltage is sensed by an external resistive voltage divider
consisting of R1 and R2. Feedback is taken from this network
by way of a series diode (D1) and a second resistor divider (R3
and R4) to the input of an amplifier.
PTAT
V
OS
g
m
NONINVERTING
WIDEBAND
DRIVER
INPUT
Q1
ADP3331
COMPENSATION
CAPACITOR
ATTENUATION
(V
BANDGAP
/V
OUT
)
R1
D1
R2
R3
R4
OUTPUT
PTAT
CURRENT
R
LOAD
C
LOAD
(a)
GND
Figure 2. Functional Block Diagram
A very high gain error amplifier is used to control this loop.
The amplifier is constructed in such a way that at equilibrium it
produces a large, temperature-proportional input offset voltage
that is repeatable and very well controlled. The temperature-
proportional offset voltage is combined with the complementary
diode voltage to form a virtual band gap voltage, implicit in the
network, although it never appears explicitly in the circuit. Ulti-
mately, this patented design makes it possible to control the loop
with only one amplifier. This technique also improves the noise
characteristics of the amplifier by providing more flexibility on
the trade-off of noise sources, which leads to a low noise design.
The R1, R2 divider is chosen in the same ratio as the band gap
voltage to output voltage. Although the R1, R2 resistor divider
is loaded by the diode D1 and a second divider consisting of R3
and R4, the values are chosen to produce a temperature stable
output. This unique arrangement specifically corrects for the
loading of the divider so that the error resulting from the base
current loading in conventional circuits is avoided.
The patented amplifier controls a new and unique noninverting
driver that drives the pass transistor, Q1. The use of this special
noninverting driver enables the frequency compensation to
include the load capacitor in a pole-splitting arrangement to
achieve reduced sensitivity to the value, type, and ESR of the
load capacitor.
Most LDOs place strict requirements on the range of ESR values
for the output capacitor because they are difficult to stabilize due
to the uncertainty of the load capacitance and resistance. More-
over, the ESR value required to keep conventional LDOs stable
changes, depending on load and temperature. These ESR limita-
tions make designing with LDOs more difficult because of their
unclear specifications and extreme variations over temperature.
The ADP3331 solves this problem. It can be used with any good
quality capacitor, with no constraint on the minimum ESR. The
innovative design allows the circuit to be stable with just a small
0.47 mF capacitor on the output. Additional advantages of the
pole-splitting scheme include superior line noise rejection and
very high regulator gain. The high gain leads to excellent regula-
tion, and ± 1.4% accuracy is guaranteed over line, load, and
temperature.
Additional features of the circuit include current limit, thermal
shutdown, and an error flag. Compared to standard solutions that
give a warning after the output has lost regulation, the ADP3331
provides improved system performance by enabling the ERR pin
to give a warning just before the device loses regulation.
As the chips temperature rises above +165C, the circuit acti-
vates a soft thermal shutdown to reduce the current to a safe
level. The thermal shutdown condition is indicated by the ERR
signal going low.
APPLICATION INFORMATION
Capacitor Selection
Output Capacitor: The stability and transient response of the
LDO is a function of the output capacitor. The ADP3331 is stable
with a wide range of capacitor values, types, and ESR (anyCAP).
A capacitor as low as 0.47 mF is all that is needed for stability;
larger capacitors can be used if high current surges on the output
are anticipated. The ADP3331 is stable with extremely low ESR
capacitors (ESR ª 0), such as multilayer ceramic capacitors
(MLCC) or OSCON. Note that the effective capacitance of some
capacitor types falls below the minimum over temperature or
with dc voltage.
Input Capacitor: An input bypass capacitor is not strictly required
but is recommended in any application involving long input
wires or high source impedance. Connecting a 0.47 mF capacitor
from the input to ground reduces the circuits sensitivity to
PC board layout and input transients. If a larger output capacitor
is necessary, a larger value input capacitor is also recommended.
Noise Reduction Capacitor: A noise reduction capacitor can be
used to reduce the output noise by 6 dB to 10 dB. This capaci-
tor limits the noise gain when connected between the feedback
pin (FB) and the output pin (OUT), as shown in Figure 3. Low
leakage capacitors in the 10 pF to 500 pF range provide the best
performance. Since FB is internally connected to a high imped-
ance node, any connection to this node should be carefully done
to avoid noise pickup from external sources. The pad connected
to this pin should be as small as possible; long PC board traces
are not recommended. When adding a noise reduction capacitor,
use the following guidelines:
Maintain a minimum load current of 1 mA when not in
shutdown.
For CNR values greater than 500 pF, add a 100 kW series
resistor (RNR).
It is important to note that as CNR increases, the turn-on time
will be delayed. With CNR values greater than 1 nF, this delay
may be on the order of several milliseconds.
B
REV.
ADP3331
–7–
V
OUT
V
IN
+
ADP3331
FB
OUT
ERR
ON
OFF
SD
GND
IN
C2
0.47F
C1
0.47F
+
E
OUT
R4
R1
R2
R
NR
C
NR
R3
Figure 3. Noise Reduction Circuit
Output Voltage
The ADP3331 has an adjustable output voltage that can be set by
an external resistor divider. The output voltage will be divided by
R1 and R2, and then fed back to the FB pin. Refer to Figure 3.
For the output voltage to have the lowest possible sensitivity to
temperature variations, it is important that the parallel resistance
of R1 and R2 be as close as possible to 230 kW:
RR
RR
k
12
12
230
¥
+
=W
(1)
Also, for the best accuracy over temperature, the feedback voltage
should set for 1.204 V:
V
R
RR
V
OUT FB
2
12+
Ê
Ë
Á
ˆ
¯
˜
=
(2)
Where V
OUT
is the desired output voltage and V
FB
is the virtual
band gap voltage. Note that V
FB
does not actually appear at the
FB pin due to loading by the internal PTAT current.
Combining the above equations and solving for R1 and R2
results in the following formulas:
R
V
V
k
OUT
FB
1 230=
Ê
Ë
Á
ˆ
¯
˜
W
(3)
R
V
V
k
FB
OUT
2
230
1
=
-
Ê
Ë
Á
ˆ
¯
˜
W
(4)
The output voltage can be adjusted to any voltage from 1.5 V to
11.75 V. For example, Table I shows some representative feed-
back resistor values for output voltages in the specified range.
Table I. Feedback Resistor Selection
V
OUT
(V) R1 (1%) R2 (1%) R3 (1%)
1.5 243 kW 1.00 MW 34.8 kW
1.8 340 kW 698 kW
2.2 422 kW 511 kW
2.7 511 kW 412 kW
3.3 634 kW 365 kW
5 953 kW 301 kW
9 1.00 MW 154 kW 97.6 kW
Note that at output voltages above 5.2 V and below 1.6 V, non-
standard resistor values or the addition of a resistor to the divider
network is required to achieve the best performance. For output
voltages below 1.6 V, select a standard resistance value for R2 and
then calculate the value of R1:
R
V
V
R
OUT
FB
112=-
Ê
Ë
Á
ˆ
¯
˜
¥
(5)
For output voltages above 5.2 V, select a standard resistance for
R1, and calculate the value of R2:
RR
V
VV
FB
OUT FB
21
-
Ê
Ë
Á
ˆ
¯
˜
(6)
After selecting values for R1 and R2, calculate the value of R3
needed to maintain the 230 kimpedance:
Rk
RR
RR
3 230
12
12
=-
¥
+
Ê
Ë
Á
ˆ
¯
˜
W
(7)
Using standard values, as shown in Table I, will sacrifice some
output voltage accuracy.
Output Current Limit
The ADP3331 is short-circuit protected by limiting the pass
transistors base drive current. The maximum output current is
limited to about 300 mA.
Thermal Overload Protection
The ADP3331 is protected by its thermal overload protection
circuit against damage due to excessive power dissipation.
Thermal protection limits the die temperature to a maximum of
165C. Under extreme conditions (i.e., high ambient tempera-
ture and power dissipation) where the die temperature starts to
rise above 165C, the output current will be reduced until the
die temperature has dropped to a safe level.
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For normal
operation, the devices power dissipation should be externally
limited so that the junction temperature will not exceed 125C.
Chip-on-Lead
The ADP3331 uses a patented Chip-on-Lead package design to
ensure the best thermal performance in a SOT-23 footprint. In a
standard SOT-23, most of the heat flows out of the ground pin.
The Chip-on-Lead package uses an electrically isolated die
attach, which allows all the pins to contribute to heat conduction.
This technique reduces the thermal resistance to 190C/W on a
2-layer board compared to >230C/W for a standard SOT-23
lead frame. Figure 4 shows the difference between the standard
SOT-23 and the Chip-on-Lead lead frames.
B
REV.
ADP3331
–8–
SILICON DIE
WITH
ELECTRICALLY
ISOLATED
DIE ATTACH
SILICON
DIE
NORMAL SOT-23-6 PACKAGE
THERMALLY ENHANCED
CHIP-ON-LEAD PACKAGE
Figure 4. Chip-on-Lead Package
Calculating Junction Temperature
Device power dissipation is calculated as follows:
PVVI VI
DINOUT LOAD IN GND
=-
()
+
()
(8)
Where I
LOAD
and I
GND
are load current and ground current and
V
IN
and V
OUT
are the input and output voltages, respectively.
Assuming that the worst case operating conditions are I
LOAD
=
200 mA, I
GND
= 4 mA, V
IN
= 4.2 V, and V
OUT
= 3.0 V, the
device power dissipation is
PVVmAVmA mW
D
=-
()
+
()
=42 30 200 42 4 257.. .
(9)
The proprietary package used on the ADP3331 has a thermal
resistance of 165C/W when placed on a 4-layer board and
190C/W when placed on a 2-layer board. This allows the ambient
temperature to be significantly higher for a given power dissipa-
tion than with a standard package. Assuming a 4-layer board, the
junction temperature rise above ambient will be approximately
equal to
D TWCWC
AJ
=0 257 165 42 4./.
oo
(10)
To limit the junction temperature to 125C, the maximum
allowable ambient temperature is
TCCC
A MAX()
..=+ - =125 42 4 82 6
ooo
(11)
Shutdown Mode
Applying a TTL level high signal to the shutdown (SD) pin, or
tying it to the input pin, will turn the output ON. Pulling the
SD to 0.4 V or below, or tying it to ground, will turn the output
OFF. In shutdown mode, the quiescent current is reduced to
less than 1 mA.
Error Flag Dropout Detector
The ADP3331 will maintain its output voltage over a wide
range of load, input voltage, and temperature conditions. If the
output is about to lose regulation due to the input voltage
approaching the dropout level, the error flag will be activated.
The ERR output is an open collector, which will be driven low.
Once set, the ERR flags hysteresis will keep the output low until
a small margin of operating range is restored either by raising
the supply voltage or reducing the load.
Low Voltage Applications
In applications where the output voltage is 2.2 V or less, the
ADP3331 may begin to exhibit some turn-on overshoot. The
degree of overshoot is determined by several factors: the output
voltage setting, the output load, the noise reduction capacitor,
and the output capacitor.
The output voltage setting is determined by the application and
cannot be tailored for minimum overshoot. In general, for output
voltages of 2.2 V or less, the overshoot becomes larger as the
output voltage decreases.
The output load is also determined by the system requirements.
However, if the ADP3331 has no load on the output during
startup, a small amount of preload can be added to minimize
overshoot. A preload of 2 mA to 20 mA is recommended.
A noise reduction capacitor, if not already being used, is sug-
gested to reduce the overshoot. Values in the range of 10 pF to
100 pF work best, along with the preload suggested previously.
The output capacitor can be adjusted to minimize the over-
shoot. Values in the 0.47 mF to 1.0 mF range should be used in
conjunction with the preload and noise reduction capacitor.
Further increases in the output capacitance may be acceptable if
the output already has a sizable load during startup.
Higher Output Current
The ADP3331 can source up to 200 mA without any heat sink
or pass transistor. If higher current is needed, an appropriate pass
transistor can be used, as in Figure 5, to increase the output
current to 1 A.
V
IN
= 3.3V
V
OUT
= 1.8V @ 1A
MJE253*
C2
10F
C1
47F
R1
50
*REQUIRES HEAT SINK
IN
OUT
ERR
GND
SD
ADP3331
FB
340k
698k
Figure 5. High Output Current Linear Regulator
Printed Circuit Board Layout Considerations
Use the following general guidelines when designing printed
circuit boards:
1. PC board traces with larger cross sectional areas will remove
more heat from the ADP3331. For optimum heat transfer,
specify thick copper and use wide traces.
2. The thermal resistance can be decreased by approximately
10% by adding a few square centimeters of copper area to
the lands connected to the pins of the LDO.
3. The feedback pin is a high impedance input, and care should
be taken when making a connection to this pin. The voltage
setting resistors and noise reduction network must be located
as close as possible. Long PC board traces are not recom-
mended. Avoid routing traces near possible noise sources.
B

ADP3331ARTZ-REEL7

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Linear Voltage Regulators High Acc Ultra-Low Quiescent Crnt LDO
Lifecycle:
New from this manufacturer.
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