NXP Semiconductors
BAT74S
Dual Schottky barrier diode
BAT74S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved
Product data sheet 22 November 2012 3 / 10
Symbol Parameter Conditions Min Max Unit
T
amb
ambient temperature -55 125 °C
T
stg
storage temperature -65 150 °C
Per device
series connection - 60 VV
R
reverse voltage
- 30 V
I
F
forward current [1] - 110 mA
I
FRM
repetitive peak forward current t
p
≤ 1 s; δ ≤ 0.5 - 200 mA
[1] If both diodes are in forward operation at the same moment, total device current is maximum 110 mA.
If one diode is in reverse and the other in forward operation at the same moment, total device current is
maximum 200 mA.
mbl889
0
100
200
300
P
tot
(mW)
150750
T
amb
(°C)
Fig. 1. Power derating curve
6. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per diode
R
th(j-a)
thermal resistance
from junction to
ambient
in free air [1] - - 416 K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.