MC34071,2,4,A MC33071,2,4,A, NCV33072,4,A
http://onsemi.com
26
PACKAGE DIMENSIONS
WQFN10
CASE 510AJ
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
C
SEATING
PLANE
D
E
0.15 C
A3
A
A1
0.15 C
DIM
A
MIN MAX
MILLIMETERS
0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D 2.60 BSC
E 2.60 BSC
0.55 0.65
L2
e 0.50 BSC
PIN ONE
REFERENCE
0.08 C
0.10 C
A0.10 C
L
e
b
B
4
10
10X
1
6
9X
0.05 C
0.45 0.55
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.90
2.90
0.73
0.50
0.30
10X
DIMENSIONS: MILLIMETERS
TOP VIEW
SIDE VIEW
BOTTOM VIEW
B
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
A
DETAIL B
DETAIL A
1
0.00 0.15
L1
9
5
L2
PITCH
10X
NOTE 3
NOTE 4
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