STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88565
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
H
SHEET
3
DSCC FORM 2234
APR 97
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
C GDIP1-T14 or CDIP2-T14 14 Dual-in-line
D GDFP1-F14 or CDFP2-F14 14 Flat pack
2 CQCC1-N20 20 Square leadless chip carrier
3 CQCC1-N28 28 Square leadless chip carrier
K GDFP2-F24 or CDFP3-F24 24 Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage (V
CC
) ................................................................................... 18 V dc
Differential input voltage .............................................................................. 1 V dc 2/
Differential input current .............................................................................. 25 mA 2/
Input voltage ................................................................................................ Supply voltage
Output short circuit duration ......................................................................... Continuous
Storage temperature range ......................................................................... -65C to +150C
Lead temperature (soldering, 60 seconds) .................................................. +300C
Power dissipation (P
D
):
Cases C and 2 ......................................................................................... 800 mW
Case D ..................................................................................................... 550 mW
Case 3 ...................................................................................................... 500 mW
Case K ..................................................................................................... 440 mW
Maximum junction temperature (T
J
) ............................................................ +150C
Thermal resistance, junction-to-case (
JC
) .................................................. See MIL-STD-1835
Thermal resistance, junction-to-ambient (
JA
):
Cases C and 2 ......................................................................................... 100C/W
Case D ..................................................................................................... 140C/W
Case 3 ...................................................................................................... 110C/W
Case K ..................................................................................................... 69C/W
1.4 Recommended operating conditions.
Ambient operating temperature range (T
A
) ................................................. -55C to +125C
Supply voltage (V
CC
) ................................................................................... 15 V
1.5 Radiation features.
Device types 01 and 02:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) .............. 100 krads(Si) 3/
Device types 03 and 04:
Maximum total dose available (dose rate 10 mrads(Si)/s) .................... 50 krads (Si) 4/
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The inputs are protected by back-to-back diodes. Current limiting resistors are not used in order to achieve low noise
performance. If the differential input voltage exceeds 1 V, the input current should be limited to 25 mA.
3/ Device types 01 and 02 may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate
effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in
MIL-STD-883, method 1019, condition A.
4/ For device type 03 and 04, radiation end point limits for the noted parameters are guaranteed for the conditions specified
in MIL-STD-883, method 1019, condition D.