AXF363500A

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ACCTB71E 201602-T
ORDERING INFORMATION
For board-to-FPC
B01
High Current Connectors
FEATURES
1. High current rating: 6 A
(3 A/pin × 2 pins)
2. Miniature design provides space-
saving benefits.
3. High removal force.
4. Helps make mobile devices thinner
thanks to its low profile height of
0.6 mm/0.8 mm.
APPLICATIONS
Battery section of miniature mobile
devices such as smartphones,
wearable terminals and tablet PCs
Socket Header
1.80mm
2.40mm
RoHS compliant
6A 6A
3A 3A
3A 3A
Socket
Header
1.80mm
3.76mm
4.45mm
2.40mm
New
Function
0: No polarity
3: Socket
4: Header
Stacking height
<Socket>/<Header>
1: 0.6 mm
3: 0.8 mm
AXF 5 0 06
Number of contacts (1 digit)
6: 6 contacts (Power contact and signal contact)
Current capacity
5: 3.0 A/Power pin
High current connectors B01
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ACCTB71E 201602-T
PRODUCT TYPES
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Stacking height Number of contacts
Part number Packing
Socket Header Inner carton (1-reel) Outer carton
0.6mm 6 AXF361500 AXF461500 15,000 pieces 30,000 pieces
0.8mm 6 AXF363500 AXF463500 15,000 pieces 30,000 pieces
Item Specifications Conditions
Electrical
characteristics
Rated current
3.0 A/pin contact (Power terminal)
0.3 A/pin contact (Signal terminal)
Rated voltage 30V AC/DC
Insulation resistance Min. 1,000MΩ (Initial stage) Using 250V DC megger (applied for 1 minute)
Dielectric strength 150V AC for 1 minute
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Contact resistance
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
According to the contact resistance measurement method of
JIS C 5402
Mechanical
characteristics
Composite insertion force Max. 40 N
Composite removal force Min. 10 N (H: 0.6, Initial stage)
Environmental
characteristics
Ambient temperature –55°C to +85°C No icing or condensation.
Storage temperature
–55°C to +85°C (Products only)
–40°C to +50°C (Packaging structure)
No icing or condensation.
Thermal shock resistance
(Header and socket mated)
After 5 cycles
Insulation resistance: Min. 100MΩ,
Contact resistance
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(Header and socket mated)
After 120 hours
Insulation resistance: Min. 100MΩ,
Contact resistance
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
Humidity 90% to 95% R.H.
Salt water spray resistance
(Header and socket mated)
After 24 hours
Insulation resistance: Min. 100MΩ,
Contact resistance
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
Salt water concentration 5%±1%
H2S resistance
(Header and socket mated)
After 48 hours
Contact resistance
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Conformed to JEIDA-38-1984
Bath temperature 40°C±2°C,
Gas concentration 3 ppm ±1 ppm,
Humidity 75% to 80% R.H.
Lifetime
characteristics
Insertion and removal life
Mechanical life: 30 times
Contact resistance:
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Composite removal force: Min. 7 N
Repeated insertion and removal cycles of max. 200 times/
hour
Soldering heat resistance
The initial specification must be satisfied electrically
and mechanically
Infrared reflow soldering: Max. peak temperature of 260°C
(PC board surface temperature near connector terminals)
Soldering iron:
300°C within 5 sec.
350°C within 3 sec.
Unit weight
6 pin contact Socket h = 0.6 mm: 0.010 g h = 0.8 mm: 0.013 g
Header h = 0.6 mm: 0.004 g h = 0.8 mm: 0.005 g
Part name Material Surface treatment
Molded portion
Heat resistant plastic (LCP resin)
(UL94V-0)
Contact and Post Copper alloy
Contact portion (Main): Au plating (Min. 0.1μm) over nickel
Contact portion (Sub): Au plating (Min. 0. 05μm) over nickel
Terminal portion: Au plating over nickel (except for top of the terminal)
Soldering terminals (Socket): Pd + Au flash plating over nickel (except for top of the terminal)
Soldering terminals (Header): Au plating over nickel (except for top of the terminal)
Order Temperature (°C) Time (minutes)
1
2
3
4
–55
85
–55
0
3
30
Max. 5
30
Max. 5
+3
0
0
3
High current connectors B01
–3–
ACCTB71E 201602-T
DIMENSIONS (Unit: mm)
Socket (Mated height: 0.6 mm and 0.8 mm)
Header (Mated height: 0.6 mm and 0.8 mm)
Socket and Header are mated
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
0.08
0.50 (Suction face)
2.40
0.86
The degree of terminal flat
(Contact and soldering terminals)
Y (Note 1)
Z (Note 1)
Signal contact (2 pins)
Power contact (4 pins)
0.18±0.03
0.20±0.03
D±0.1
C±0.1
0.58±0.03
0.14±0.03
E
2.16
B±0.1
A
General tolerance: ±0.2
Note: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically.
Dimension table (mm)
Number of pins/
dimension
A B C D
6 4.45 1.60 3.85 3.12
Mated height/
dimension
E
0.6mm 0.59
0.8mm 0.79
CAD Data
0.08
1.51
1.80
(0.34)
0.88
The degree of terminal flat
(Post and soldering terminals)
Signal contact (2 pins)
Power contact (4 pins)
(Soldering
terminal)
C±0.1
0.20±0.03
0.70±0.03
0.14±0.03
B±0.1
A
D
0.70 (Suction face)
General tolerance: ±0.2
Dimension table (mm)
Number of pins/
dimension
A B C
6 3.76 1.60 3.26
Mated height/
dimension
D
0.6mm 0.47
0.8mm 0.65
CAD Data
Socket
Header
0.60±0.1
Socket
Header
0.80±0.1

AXF363500A

Mfr. #:
Manufacturer:
Panasonic
Description:
CONN SOCKET 6POS SMD GOLD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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