NCP1124, NCP1126, NCP1129
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4
Table 4. MAXIMUM RATINGS (Note 5)
Rating
Symbol Value Unit
Drain Input Voltage (Referenced to Source Terminal) NCP112x V
Drain
−0.3 to 650 V
Drain Maximum Pulsed Current NCP1129
(10 ms Single Pulse, T
J
= 25°C) NCP1126
NCP1124
I
DM
27
11
7
A
Single Pulse Avalanche Energy NCP1126, NCP1129
NCP1124
E
AS
96
60
mJ
Supply Input Voltage V
CC(MAX)
−0.3 to 35 V
Current Sense Input Voltage V
CS
−0.3 to 10 V
Feedback Input Voltage V
FB
−0.3 to 10 V
Operating Junction Temperature T
J
−40 to 150
_C
Storage Temperature Range T
STG
–60 to 150
_C
Power Dissipation (T
A
= 25_C, 2 Oz Cu, 600 mm
2
Printed Circuit Copper Clad)
P
D
1.5 W
Thermal Resistance, Junction to Ambient 2 Oz Cu Printed Circuit Copper Clad
Low Conductivity (Note 6)
High Conductivity (Note 7)
R
θ
JA
128
78
_C/W
ESD Capability (Note 8)
Human Body Model ESD Capability per JEDEC JESD22−A114F.
Machine Model ESD Capability per JEDEC JESD22−A115C.
Charged−Device Model ESD Capability per JEDEC JESD22−C101E.
2000
200
500
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
5. This device contains Latch−Up protection and exceeds ±100 mA per JEDEC Standard JESD78.
6. Low Conductivity Board. As mounted on 40 x 40 x 1.5 mm FR4 substrate with a single layer of 50 mm
2
of 2 oz copper trances and heat
spreading area. As specified for a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection of zero air flow.
7. High Conductivity Board. As mounted on 40 x 40 x 1.5 mm FR4 substrate with a single layer of 600 mm
2
of 2 oz copper trances and heat
spreading area. As specified for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection of zero air flow.
8. The Drain pins (5 and 6), are rated to the maximum voltage of the device, or 650 V.
