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N04L63W1AB27IT
P1-P3
P4-P6
P7-P9
P10-P10
Rev.
13
| Page 7 of 10 | www.onsemi.com
N04L63W1A
Timing W
aveform of W
rite Cycle (WE
control)
Timing W
aveform of W
rite Cycle (CE
Control)
Address
Data In
CE
LB
, UB
Dat
a V
alid
t
WC
t
AW
t
CW
t
WR
t
WHZ
t
DH
High-Z
WE
Dat
a Out
High-
Z
t
OW
t
AS
t
WP
t
DW
t
BW
Address
WE
Data V
alid
t
WC
t
AW
t
CW
t
WR
t
DH
LB
, UB
Data In
High-
Z
t
AS
t
WP
t
LZ
t
DW
t
BW
Data Out
t
WHZ
CE
Rev.
13
| Page 8 of 10 | www.onsemi.com
N04L63W1A
44-Lead TSOP II Package (T44)
Note:
1. All dimensions in inches (Millimeters)
2. Package dimensions exclude molding flash
18.41±0.13
10.16±0.13
SEE DET
AIL B
1.10±0.15
1
1.76±0.20
0.45
0.30
0.80mm REF
DET
AIL B
0.80mm REF
0
o
-8
o
0.20
0.00
Rev.
13
| Page 9 of 10 | www.onsemi.com
N04L63W1A
Ball Grid Array Package
Dimensions (mm)
DE
e = 0.75
BALL
MA
TRIX
TYPE
SD
SE
J
K
6±0.10
8±0.10
0.375
0.375
1
.125
1.375
FULL
SIDE VIEW
TOP VIEW
BOTTOM VIEW
E
D
A1 BALL P
AD
CORNER (3)
1.24±0.10
0.28±0.05
0.15
0.05
Z
Z
1. 0.35±0.05 DIA.
1. DIMENSION IS MEASURED A
T THE
MAXIMUM SOLDER BALL DIAMETER.
P
ARALLE
L TO PRIMAR
Y Z.
2. PRIMARY
DA
TUM Z AND SEA
TING
PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE
SOLDER BALLS.
3. A1 BALL P
AD CORNER
I.D. TO BE
MARKED BY INK.
2. SEA
TING PLANE - Z
SD
SE
e
K TYP
J TYP
e
A1 BALL P
AD
CORNER
P1-P3
P4-P6
P7-P9
P10-P10
N04L63W1AB27IT
Mfr. #:
Buy N04L63W1AB27IT
Manufacturer:
ON Semiconductor
Description:
IC SRAM 4M PARALLEL 48BGA
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
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