N04L63W1AB27IT

Rev. 13 | Page 7 of 10 | www.onsemi.com
N04L63W1A
Timing Waveform of Write Cycle (WE control)
Timing Waveform of Write Cycle (CE
Control)
Address
Data In
CE
LB, UB
Data Valid
t
WC
t
AW
t
CW
t
WR
t
WHZ
t
DH
High-Z
WE
Data Out
High-Z
t
OW
t
AS
t
WP
t
DW
t
BW
Address
WE
Data Valid
t
WC
t
AW
t
CW
t
WR
t
DH
LB, UB
Data In
High-Z
t
AS
t
WP
t
LZ
t
DW
t
BW
Data Out
t
WHZ
CE
Rev. 13 | Page 8 of 10 | www.onsemi.com
N04L63W1A
44-Lead TSOP II Package (T44)
Note:
1. All dimensions in inches (Millimeters)
2. Package dimensions exclude molding flash
18.41±0.13
10.16±0.13
SEE DETAIL B
1.10±0.15
11.76±0.20
0.45
0.30
0.80mm REF
DETAIL B
0.80mm REF
0
o
-8
o
0.20
0.00
Rev. 13 | Page 9 of 10 | www.onsemi.com
N04L63W1A
Ball Grid Array Package
Dimensions (mm)
DE
e = 0.75
BALL
MATRIX
TYPE
SD SE J K
6±0.10 8±0.10 0.375 0.375 1.125 1.375 FULL
SIDE VIEWTOP VIEW
BOTTOM VIEW
E
D
A1 BALL PAD
CORNER (3)
1.24±0.10
0.28±0.05
0.15
0.05
Z
Z
1. 0.35±0.05 DIA.
1. DIMENSION IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER.
PARALLEL TO PRIMARY Z.
2. PRIMARY DATUM Z AND SEATING
PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE
SOLDER BALLS.
3. A1 BALL PAD CORNER I.D. TO BE
MARKED BY INK.
2. SEATING PLANE - Z
SD
SE
e
K TYP
J TYP e
A1 BALL PAD
CORNER

N04L63W1AB27IT

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC SRAM 4M PARALLEL 48BGA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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