14 AT24C04B/08B
5226G–SEEPR–11/09
10. AT24C08B Ordering Information
Table 6. Ordering Information
Ordering Code Voltage Package Operational range
AT24C08B-PU (Bulk form only) 1.8 8P3
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
AT24C08BN-SH-B
(1)
(NiPdAu Lead Finish) 1.8 8S1
AT24C08BN-SH-T
(2)
(NiPdAu Lead Finish) 1.8 8S1
AT24C08B-TH-B
(1)
(NiPdAu Lead Finish) 1.8 8A2
AT24C08B-TH-T
(2)
(NiPdAu Lead Finish) 1.8 8A2
AT24C08BY6-YH-T
(2)
(NiPdAu Lead Finish) 1.8 8Y6
AT24C08B-TSU-T
(2)
1.8 5TS1
AT24C08BU3-UU-T
(2)
1.8 8U3-1
AT24C08B-W-11
(3)
1.8 Die Sale Industrial Temperature (-40°C to 85°C)
Note: 1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K
per reel.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Please contact Serial
Interface Marketing.
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y6
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5TS1
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8U3-1
8-ball, die Ball Grid Array Package (dBGA2)
Options
-1.8
Low-voltage (1.8V to 5.5V)
