Two-wire Serial EEPROM
25
5226G–SEEPR–11/09
5TS1 – SOT23
Figure 19. 5TS1 – SOT23
1150 E. Cheyenne Mtn . Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
PO5TS1 A
6/25/03
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
Small Outline Package (SHRINK SOT)
A–1.10
A1 0.00 0.10
A2 0.70 0.90 1.00
c0.080.204
D 2.90 BS C 2, 3
E 2.80 BS C 2, 3
E1 1.60 BS C 2, 3
L1 0.60 REF
e 0.95 BSC
e1 1.90 BSC
b 0.30 0.50 4, 5
NOTES: 1. This drawing is for gene ral information onl y. Refer to JEDEC D rawing
MO-193, Variation A B, for additional in formation.
2. Dimension D does not include mold flash, prot rusions, or gate burrs.
Mold flash, prot rusions, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include inte rlead flash or prot rusion. Interlead
flash or prot rusion shall not exceed 0.15 mm per sid e.
3. The pa ckage top m ay be smaller than the pa ckage bottom . Dimensions
D and E1 are dete rmined at the oute rmost extremes of the plastic body
exclusive of mold flash, tie bar burrs, gate burrs, and inte rlead flash, but
including a ny mismatch bet ween the top and bottom of the plastic bod y.
4. These dimensions apply to the flat section of the lead bet ween 0.08 mm
and 0.15 mm from the lead ti p.
5. Dimension "b" does not include Dambar prot rusion. Allowable Dambar
protrusion shall be 0.08 mm total in excess of the "b" dimension at
maximum mate rial condition . The Dambar cannot be located on the l ower
radius of the foot. Minimum space bet ween prot rusion and an adjacent lead
shall not be less than 0.07 mm.
5
4
2
L1
L
C
End View
C
A
A2
A1
b
e
Seating
Plane
D
Side View
e1
E1
3
1
Top View
E
26 AT24C04B/08B
5226G–SEEPR–11/09
8U3-1 – Dbga2
Figure 20. 8U3-1 – Dbga2
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
PO8U3-1 A
6/24/03
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
A 0.71 0.81 0.91
A1 0.10 0.15 0.20
A2 0.40 0.45 0.50
b 0.20 0.25 0.30
D 1.50 BSC
E 2.00 BSC
e 0.50 BSC
e1 0.25 REF
d 1.00 BSC
d1 0.25 REF
1. Dimension “b” is measured at the maximum solder ball diameter.
This drawing is for general information only.
Bottom Vi ew
8 SOLDER BALLS
b
D
E
Top View
PIN 1 BALL PAD CORNER
A
Side View
A
2
A
1
4
5
PIN 1 BALL PAD CORNER
31
e
2
67
8
d
(e1)
(d1)
1.
Two-wire Serial EEPROM
27
5226G–SEEPR–11/09
13. Revision History
Table 7. Revision History
Doc. Rev. Date Comments
5226G 11/2009 Corrected AC Characteristics, T
AA
minimum value from 0.55 to 0.05
5226F 5/2009 Corrected AT24C08B Part Marking Scheme
5226E 12/2008 Add AT24C08B Device Package Marking Details and removed Bumped wafer offering.
5226D 08/2008 Update into MS Format.
5226D 07/2008 Removed ‘Preliminary’ status
5226C 02/2008 Text changes on page 4 and 9
5226B 08/2007
Updated to new template
Updated common Figures
Added Package Marking tables
5226A 06/2007 Initial document release

AT24C04B-TH-B

Mfr. #:
Manufacturer:
Description:
IC EEPROM 4K I2C 1MHZ 8TSSOP
Lifecycle:
New from this manufacturer.
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