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TLP2166A(F)

P1-P3P4-P6P7-P9P10-P11
TLP2166A
2014-09-22
7
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2.
Figure 2 Tape Forms
Table 2 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
Symbol Dimension Remark
A 6.5 ―
B 5.6 ―
D 5.5 Center line of indented square hole and sprocket hole
E 1.75 Distance between tape edge and hole center
F 8.0 Cumulative error (max) per 10 feed holes
G 4.0 Cumulative error (max) per 10 feed holes
K
0
3.1 Internal space
+0.1
-0.3
+0.1
-0.3
φ1.6 ± 0.1
0.3 ± 0.05
3.3 ± 0.1
A
D
B
E
F
G
K
0
12.0 ± 0.3
φ1.5
+0.1
−0
TLP2166A
2014-09-22
8
3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
Figure 3 Reel Form
Table 3 Reel Dimensions
Unit: mm
Symbol Dimension
A Φ330 ±2
B Φ80 ±1
C Φ13 ±0.5
E 2.0 ±0.5
U 4.0 ±0.5
W1 13.5 ±0.5
W2 17.5 ±1.0
4. Packing
Either one reel or five reels of photocoupler are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard,
the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the
following example.
(Example)
W2
A
B
C
U
TLP2166A
(
TP
)
2500
p
cs
Device name
Tape type
1
Quantity (must be a multiple of 2500)
TLP2166A
2014-09-22
9
Precautions of Surface Mounting Type Photocoupler Soldering & General Storage
(1) Precautions for Soldering
1) When Using Soldering Reflow
An example of a temperature profile when Sn-Pb eutectic solder is used:
An example of a temperature profile when lead(Pb)-free solder is used:
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 °C for 60 to 120 seconds.
Mounting condition of 260 °C or less within 10 seconds is recommended.
Flow soldering must be performed once
3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding °C or within 3 seconds
not exceeding 350 °C.
Heating by soldering iron must be only once per 1 lead
P1-P3P4-P6P7-P9P10-P11

TLP2166A(F)

Mfr. #:
Buy TLP2166A(F)
Manufacturer:
Toshiba
Description:
High Speed Optocouplers IC, Dual CH Dual Photocoupler
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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