NCN5150
www.onsemi.com
10
Because the M-BUS protocol is specified as half-duplex,
an echo function will cause the transmitted signal on RX or
RXI to appear on the receiver outputs TX and TXI. Should
the master attempt to send at the same time, the bitwise
added signal of both sources will appear on these pins,
resulting in invalid data.
Figure 10. Communication, Slave to Master
V
RXI
V
IO
I
SPACE
= I
MARK
+ 15 mA
t
V
IO
t
t
V
RX
I
BUS
I
MARK
= N unit loads
Figure 11. Communication, Slave to Master
Decoding
V
B
RXI
Echo
RX
V
IO_BUF
RIS
+
Enable
Power On/Off Sequence
The power-on and power-off sequence of the NCN5150
is shown in Figure 12. Shown also in Figure 12 is the
operation of the PFb pin. This pin is used to give an early
warning to the microcontroller that the bus power is
collapsing, allowing the microcontroller to save its data and
shut down gracefully. The times t
on
and t
off
can be
approximated by the following formulas:
t
on
+
C
STC
I
STC
V
STC, VDD ON
(eq. 1)
t
off
+
C
STC
I
CC
) I
DD
ǒ
V
STC, Clamp
* V
STC, VDD OFF
Ǔ
(eq. 2)
Where I
CC
is the internal current consumption of the
NCN5150 and I
DD
is the current consumed by external
circuits drawn from either VDD or STC.
These formulas can be used to dimension the value of the
bulk C
STC
needed, taking into account that the M-BUS
standard requires t
on
to be less than 3 s.
For certain applications where the power drawn from the
bus is not used in external circuits, the storage capacitor
value can be much lower. The NCN5150 requires a
minimum STC capacitance of 10 mF to ensure that the bus
current regulation is stable under all conditions.
Figure 12. Power-on and Power-off
t
V
BUS
t
t
t
t
V
STC
V
VS
V
DD
V
PFb
t
off
V
IO
3.3 V
V
STC, CLAMP
V
STC, CLAMP
V
STC, VDD
ON
V
STC, VDD
OFF
V
B
= V
STC
+ 0.6
V
B
= V
B, MIN
t
on
Thermal Shutdown
The NCN5150 includes a thermal shutdown function that
will disable the transmitter when the junction temperature of
the IC becomes too hot. The thermal protection is only active
when the slave is transmitting a space to the master.
Table 10. ORDERING INFORMATION
Device Package Shipping
NCN5150DG
SOIC16
(Pb-free)
48 Units / Tube
NCN5150DR2G 3,000 / Tape & Reel
NCN5150MNTWG NQFP20, 4x4
(Pb-free)
2,500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCN5150
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11
PACKAGE DIMENSIONS
QFN20, 4x4, 0.5P
CASE 485E
ISSUE B
2.88
20X
0.35
20X
0.58
4.30
0.50
DIMENSIONS: MILLIMETERS
1
*For additional information on our Pb-free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PITCH
PKG
OUTLINE
DIM MIN MAX
MILLIMETERS
D 4.00 BSC
E 4.00 BSC
A 0.80 1.00
b 0.20 0.30
e 0.50 BSC
L1 0.00 0.15
A3 0.20 REF
A1 --- 0.05
L 0.35 0.45
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
D2
E2
1
6
11
20
D2 2.60 2.90
E2 2.60 2.90
e
L1
DETAIL A
L
OPTIONAL CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL CONSTRUCTIONS
A
B
E
D
2X
0.15 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.15 C
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
DETAIL B
BOTTOM VIEW
b
20X
0.10 B
0.05
AC
C
NOTE 3
DETAIL A
K 0.20 REF
0.10 BAC
L20X
0.10 BAC
K
4.30
2.88
NCN5150
www.onsemi.com
12
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
−B−
−A−
M
0.25 (0.010) B
S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
____
6.40
16X
0.58
16X
1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
16
89
8X
*For additional information on our Pb-free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages.Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NCN5150/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
al
Sales Representative

NCN5150DR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Interface - Specialized NCN5150 SOIC OAC
Lifecycle:
New from this manufacturer.
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