HMC349AMS8GE

HMC349AMS8G Data Sheet
Rev. C | Page 6 of 10
TYPICAL PERFORMANCE CHARACTERICS
INSERTION LOSS, RETURN LOSS, AND ISOLATION
0 5.0
FREQUENCY (GHz)
T
CASE
= +125°C
T
CASE
= +105°C
T
CASE
= +85°C
T
CASE
= +25°C
T
CASE
= –40°C
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
–3.0
INSERTION LOSS (dB)
–2.5
–2.0
–1.5
–1.0
–0.5
15025-006
Figure 6. Insertion Loss Between RFC and RF1/RF2 vs. Frequency
over Temperature
0
–100
0 5.0
ISOLATION (dB)
FREQUENCY (GHz)
–90
–80
–70
–60
–50
–40
–30
–20
–10
0.5 1.0
1.5 2.0
2.5
3.0 3.5
4.0 4.5
T
CASE
= +125°C
T
CASE
= +105°C
T
CASE
= +85°C
T
CASE
= +25°C
T
CASE
= –40°C
15025-007
Figure 7. Isolation Between RFC and RF1/RF2 vs. Frequency
over Temperature
0
–100
0 5.0
ISOLATION (dB)
FREQUENCY (GHz)
–90
–80
–70
–60
–50
–40
–30
–20
–10
0.5
1.0 1.5 2.0 2.5 3.0 3.5
4.0 4.5
T
CASE
= +125°C
T
CASE
= +105°C
T
CASE
= +85°C
T
CASE
= +25°C
T
CASE
= –40°C
15025-008
Figure 8. Isolation Between RFC and RF1/RF2 in an All Off State (EN = V
DD
) vs.
Frequency over Temperature
0
–40
RETURN LOSS (dB)
–35
–30
–25
–20
–15
–10
–5
0 5.0
FREQUENCY (GHz)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
RFC
RF1/RF2 ON
RF1/RF2 OFF
15025-009
Figure 9. Return Loss for RFC, RF1/RF2 On, and RF1/RF2 Off vs. Frequency
0
–100
0 5.0
ISOLATION (dB)
FREQUENCY (GHz)
–90
–80
–70
–60
–50
–40
–30
–20
–10
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
T
CASE
= +125°C
T
CASE
= +105°C
T
CASE
= +85°C
T
CASE
= +25°C
T
CASE
= –40°C
15025-010
Figure 10. Isolation Between RF1 and RF2 vs. Frequency over
Temperature
0
–100
0 5.0
ISOLATION (dB)
FREQUENCY (GHz)
–90
–80
–70
–60
–50
–40
–30
–20
–10
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
T
CASE
= +125°C
T
CASE
= +105°C
T
CASE
= +85°C
T
CASE
= +25°C
T
CASE
= –40°C
15025-011
Figure 11. Isolation Between RF1 and RF2 in an All Off State (EN = V
DD
) vs.
Frequency over Temperature
Data Sheet HMC349AMS8G
Rev. C | Page 7 of 10
INPUT POWER COMPRESSION AND THIRD-ORDER INTERCEPT (IP3)
40
20
0 5.0
INPUT P0.1dB (dBm)
FREQUENCY (GHz)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
T
CASE
= +85°C
T
CASE
= +25°C
T
CASE
= –40°C
22
24
26
28
30
32
34
36
38
15025-012
Figure 12. Input 0.1 dB Power Compression (P0.1dB) vs. Frequency over
Temperature, V
DD
= 5 V
0 5.0
INPUT P1dB (dBm)
FREQUENCY (GHz)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
T
CASE
= +85°C
T
CASE
= +25°C
T
CASE
= –40°C
36
16
18
20
22
24
26
28
30
32
34
15025-013
Figure 13. Input 1 dB Power Compression (P1dB) vs. Frequency over
Temperature, V
DD
= 5 V
0 5.0
FREQUENCY (GHz)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
60
30
INPUT IP3 (dBm)
T
CASE
= +85°C
T
CASE
= +25°C
T
CASE
= –40°C
35
40
45
50
55
15025-014
Figure 14. Input IP3 vs. Frequency over Temperature, V
DD
= 5 V
0 5.0
INPUT P0.1dB (dBm)
FREQUENCY (GHz)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
T
CASE
= +85°C
T
CASE
= +25°C
T
CASE
= –40°C
36
16
18
20
22
24
26
28
30
32
34
15025-015
Figure 15. Input 0.1 dB Power Compression (P0.1dB) vs.
Frequency over Temperature, V
DD
= 3 V
0 5.0
INPUT P1dB (dBm)
FREQUENCY (GHz)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
T
CASE
= +85°C
T
CASE
= +25°C
T
CASE
= –40°C
36
16
18
20
22
24
26
28
30
32
34
15025-016
Figure 16. Input 1 dB Power Compression (P1dB) vs.
Frequency over Temperature, V
DD
= 3 V
0 5.0
INPUT IP3 (dBm)
FREQUENCY (GHz)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
T
CASE
= +85°C
T
CASE
= +25°C
T
CASE
= –40°C
60
30
35
40
45
50
55
15025-017
Figure 17. Input IP3 vs. Frequency over Temperature, V
DD
= 3 V
HMC349AMS8G Data Sheet
Rev. C | Page 8 of 10
THEORY OF OPERATION
The HMC349AMS8G requires a positive supply voltage applied
to the VDD pin. Bypassing capacitors are recommended on the
supply lines to minimize RF coupling.
The HMC349AMS8G is internally matched to 50 Ω at the RF
common port (RFC) and the RF throw ports (RF1 and RF2);
therefore, no external matching components are required. All
of the RF ports are dc-coupled and dc blocking capacitors are
required at the RF ports. The design is bidirectional; the RF
input signal can be applied to the RFC port while the RF throw
port (RF1 or RF2) is output, or vice versa.
The HMC349AMS8G incorporates a driver to perform logic
functions internally and to provide the user with the advantage
of a simplified control interface. The driver features two digital
control input pins, CTRL and EN.
When the EN pin is logic low, the RF1 to RFC path is in an
insertion loss state, and the RF2 to RFC path is in an isolation
state, or vice versa, depending on the logic level applied to the
CTRL pin. The insertion loss path (for example, RF1 to RFC)
conducts the RF signal equally well in both directions between
the throw port (for example, RF1) and the common port (RFC).
The isolation path (for example, RF2 to RFC) provides high loss
between the insertion loss path and the throw port (for example,
RF2) terminated to an internal 50 Ω resistor.
When the EN pin is logic high, both the RF1 to RFC path and
the RF2 to RFC path are in an isolation state, regardless of the
logic state of CTRL. The RF1 and RF2 ports are terminated to
internal 50 Ω resistors, and RFC becomes open reflective.
The ideal power-up sequence is as follows:
1. Connect GND.
2. Power up VDD.
3. Power up the digital control inputs. The relative order of
the logic control inputs is not important. However, powering
the digital control inputs before the VDD supply can
inadvertently forward bias and damage the internal ESD
protection structures.
4. Apply an RF input signal. The design is bidirectional; the
RF input signal can be applied to the RFC port while the
RF throw ports are outputs, or vice versa. All of the RF
ports are dc-coupled to VDD through internal resistors; there-
fore, dc blocking capacitors are required at the RF ports.
Table 4. Control Voltage Truth Table
Digital Control Input RF Paths
EN CTRL RF1 to RFC RF2 to RFC
Low Low Isolation (off ) Insertion loss (on)
Low High Insertion loss (on) Isolation (off )
High Low Isolation (off ) Isolation (off)
High High Isolation (off ) Isolation (off)

HMC349AMS8GE

Mfr. #:
Manufacturer:
Analog Devices / Hittite
Description:
RF Switch ICs DC-4GHz Hi Isolation Switch
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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