MCS0402PD2002DE500

MCS 0402 HP, MCT 0603 HP, MCU 0805 HP
www.vishay.com
Vishay Beyschlag
Revision: 28-Nov-17
7
Document Number: 28916
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
FUNCTIONAL PERFORMANCE
Pulse load rating in accordance with EN 60115-1 clause 4.27; 10 μs/700 μs;
10 pulses at 1 min intervals; for permissible resistance change ± (0.5 % R + 0.05 )
10/700 Pulse
TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8, sectional specification
EN 140401-801, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
100 V
1 kV
10 V
10 kV
Resistance Value
Test Voltage
100 Ω 1 kΩ 10 kΩ 100 kΩ
10 Ω
1 MΩ
R
MCT 0603 HP
MCU 0805 HP
MCS 0402 HP
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
MCS 0402 HP 47 to 100 k
MCT 0603 HP 1 to 100 k
MCU 0805 HP 1 to 100 k
4.5 - Resistance - ± 1 % R; ± 0.5 % R; ± 0.1 % R
4.8 -
Temperature
coefficient
At (20/-55/20) °C and
(20/155/20) °C
± 50 ppm/K; ± 25 ppm/K
4.25.1 -
Endurance at 70 °C:
power operation mode
U = or U = U
max.
;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.2 % R + 0.05 )
70 °C; 8000 h ± (0.4 % R + 0.05 )
Endurance at 85 °C:
advanced temperature
operation mode
U = or U = U
max.
;
whichever is the less severe;
1.5 h on; 0.5 h off;
85 °C; 1000 h ± (0.3 % R + 0.05 )
P
70
x R
P
85
x R
MCS 0402 HP, MCT 0603 HP, MCU 0805 HP
www.vishay.com
Vishay Beyschlag
Revision: 28-Nov-17
8
Document Number: 28916
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents
(2)
Tested on a 4-layer printed circuit board with SAC micro alloy
4.25.3 -
Endurance at
upper category
temperature
155 °C; 1000 h
175 °C; 1000 h
± (0.2 % R + 0.05 )
± (0.3 % R + 0.05 )
4.24 78 (Cab)
Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
± (0.1 % R + 0.05 )
4.37 67 (Cy)
Damp heat,
steady state,
accelerated
Power operation mode
(85 ± 2) °C
(85 ± 5) % RH
U = ;
U 0.3 x U
max.
; 1000 h
± (0.5 % R + 0.05 )
4.19 14 (Na)
Rapid change of
temperature
30 min. at -55 °C and
30 min. at 155 °C;
1 000 cycles
± (0.25 % R + 0.05 )
Extended rapid change
of temperature
30 min at -40 °C;
30 min at 125 °C
(2)
;
MCS 0402 HP: 3000 cycles
MCT 0603 HP: 2000 cycles
MCU 0805 HP: 1500 cycles
± (0.25 % R + 0.05 );
( 50 % of initial shear force)
4.13 -
Short time overload;
power operation mode
U = 2.5 x or U = 2 × U
max.
;
whichever is the less severe; 5 s
± (0.25 % R + 0.05 )
4.38 -
Electro static discharge
(human body model)
IEC 61340-3-1
(1)
;
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
method 3015)
MCS 0402 HP: 500 V
MCT 0603 HP: 1000 V
MCU 0805 HP: 1500 V
± (0.5 % R + 0.05)
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s
2
; 7.5 h
± (0.1 % R + 0.05)
no visible damage
4.17 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
4.18 58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.1 % R + 0.05)
no visible damage
4.29 45 (XA)
Component solvent
resistance
Isopropyl alcohol +50 °C;
method 2
No visible damage
4.32 21 (Ue
3
) Shear (adhesion)
RR1005M and RR1608M; 9 N
No visible damage
RR2012M; 45 N
4.33 21 (Ue
1
) Substrate bending Depth 2 mm, 3 times
± (0.1 % R + 0.05)
no visible damage;
no open circuit in bent position
4.7 - Voltage proof
U
RMS
;
MCS 0402 HP: 75 V
MCT 0603 HP: 100 V
MCU 0805 HP: 200 V
(60 ± 5) s
No flashover or breakdown
4.35 - Flammability
IEC 60695-11-5
(1)
needle flame test; 10 s
No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
MCS 0402 HP 47 to 100 k
MCT 0603 HP 1 to 100 k
MCU 0805 HP 1 to 100 k
0.1 x P
70
x R
P
70
x R
MCS 0402 HP, MCT 0603 HP, MCU 0805 HP
www.vishay.com
Vishay Beyschlag
Revision: 28-Nov-17
9
Document Number: 28916
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS
SOLDER PAD DIMENSIONS
Notes
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x
(1)
,
or in publication IPC-7351
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents
DIMENSIONS AND MASS
TYPE / SIZE
H
(mm)
L
(mm)
W
(mm)
W
T
(mm)
T
t
(mm)
T
b
(mm)
MASS
(mg)
MCS 0402 HP 0.32 ± 0.05 1.0 ± 0.05 0.5 ± 0.05 > 75 % of W 0.2 + 0.1/- 0.15 0.2 ± 0.1 0.6
MCT 0603 HP 0.45 + 0.1/- 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2 1.9
MCU 0805 HP 0.52 ± 0.1 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.6
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
WAVE SOLDERING REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCS 0402 HP - - - - 0.35 0.55 0.55 1.45
MCT 0603 HP 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05
MCU 0805 HP 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70
T
b
T
t
L
H
W
W
T
G
X
Y
Z

MCS0402PD2002DE500

Mfr. #:
Manufacturer:
Description:
Thin Film Resistors - SMD .200W 20Kohms .5% 0402 25ppm Hi Power
Lifecycle:
New from this manufacturer.
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