Philips Semiconductors Product data
74F2998-bit universal shift/storage register (3-State)
2003 Feb 05
6
DC ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range unless otherwise noted.
LIMITS
MIN TYP
2
MAX
±10%V
CC
2.5 V
p
,
V
CC
= MIN,
OH
= –
±5%V
CC
2.7 3.4 V
OH
-
v
u
u
v
IL
=
,
V
IH
= MIN
±10%V
CC
2.4 V
OH
= –
±5%V
CC
2.7 3.3 V
p
V
CC
= MIN,
±10%V
CC
0.35 0.50 V
OL
-
v
u
u
v
IL
=
,
V
IH
= MIN
OL
=
±5%V
CC
0.35 0.50 V
V
IK
Input clamp voltage V
CC
= MIN, I
I
= I
IK
–0.73 –1.2 V
I
I
Input current at maximum
others V
CC
= MAX, V
I
= 7.0 V 100 µA
input voltage
I/On V
CC
= 5.5V, V
I
= 5.5 V 1 mA
I
IH
HIGH-level input current
except
I/On
V
CC
= MAX, V
I
= 2.7 V 20 µA
p
S0, S1
–1.2 mA
IL
-
v
u
u
others
CC
=
,
I
=
.
–0.6 mA
I
IH
+
I
OZH
Off-state output current,
HIGH-level voltage applied
I/On
V
CC
= MAX, V
O
= 2.7 V 70 µA
I
IL
+
I
OZL
Off-state output current
LOW-level voltage applied
only
V
CC
= MAX, V
O
= 0.5 V –0.6 mA
I
OS
Short-circuit output current
3
V
CC
= MAX –60 –150 mA
I
CCH
55 60 mA
I
CC
Supply current (total) I
CCL
V
CC
= MAX 70 90 mA
I
CCZ
65 95 mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5 V, T
amb
= 25 °C.
3. Not more than one output should be shorted at a time. For testing I
OS
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a HIGH output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
OS
tests should be performed last.