SST12CP12
DS70005124B-page 4 2013 Microchip Technology Inc.
2.0 PIN ASSIGNMENTS
FIGURE 2-1: PIN ASSIGNMENTS FOR 16-CONTACT UQFN
3.0 PIN DESCRIPTIONS
56 8
16
VCC1
15 14
VCC2
NC
9
11
12
10
13
NC
VREF2
VREF3
GND
DET
VCC3
RFOUT
RFOUT
NC
2
1
4
3
VCCb
RFIN
NC
VREF1
7
70005121 16-vqfn P1.2
Top View
(contacts facing down)
RF and DC GND
0
TABLE 3-1: PIN DESCRIPTION
Symbol Pin No. Pin Name Type
1
1. I=Input, O=Output
Function
GND 0 Ground The center pad should be connected to RF ground
with several low inductance, low resistance vias.
VCCb 1 Power Supply Bias circuit supply
RFIN 2IRF input, DC decoupled
NC 3 No Connection Unconnected, no internal connection
VREF1 4 Power Supply PWR 1
st
stage idle-current control
VREF2 5 Power Supply PWR 2
nd
stage idle-current control
VREF3 6 Power Supply PWR 3rd stage idle-current control
GND 7 Ground
Det 8OOn-chip power detector
NC 9 No Connection Unconnected, no internal connection
RFOUT 10 O RF output
RFOUT 11 O RF output
VCC3 12 Power Supply PWR Power supply, 3rd stage
NC 13 No Connection Unconnected, no internal connection
VCC2 14 Power Supply PWR Power supply, 2nd stage
NC 15 No Connection Unconnected pins.
VCC1 16 Power Supply PWR Power supply, 1st stage
2013 Microchip Technology Inc. DS70005124B-page 5
SST12CP12
4.0 ELECTRICAL SPECIFICATIONS
The AC and DC specifications for the power amplifier
interface signals. Refer to Table 4-2 for the DC voltage
and current specifications. Refer to Figures 5-1 through
6-5 for the RF performance.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maxi-
mum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and func-
tional operation of the device at these conditions or conditions greater than those defined in the operational
sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may
affect device reliability.)
Input power to pins 2 and 3 (P
IN
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 dBm
Supply Voltage at pins 5, 12, 14, 16 (V
CC
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6V
Reference voltage to pins 4 (V
REF1
) and pin 7 (V
REF2
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+3.5V
DC supply current (I
CC
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750 mA
Operating Temperature (T
A
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC
Storage Temperature (T
STG
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC
Maximum Junction Temperature (T
J
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150ºC
Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
TABLE 4-1: OPERATING RANGE
Range Ambient Temp V
CC
Industrial -40°C to +85°C 3.0V to 5.0V
TABLE 4-2: DC ELECTRICAL CHARACTERISTICS AT 25ºC
Symbol Parameter Min. Typ Max. Unit
V
CC
Supply Voltage at pins 5, 12, 14, 16 4.0 5.0 5.5 V
I
CC
Average Current at 100% duty cycle
for 802.11g, 28.5 dBm 670 mA
for 802.11b, 28.5 dBm 670 mA
for 256 QAM, 27 dBm 600 mA
I
CQ
Idle current for 802.11g to meet EVM<3% @24.5 dBm, 100% duty
cycle
375 mA
V
REG
Reference Supply 2.90 3.10 3.15 V
SST12CP12
DS70005124B-page 6 2013 Microchip Technology Inc.
TABLE 4-3: AC ELECTRICAL CHARACTERISTICS FOR CONFIGURATION AT 25ºC
Symbol Parameter Min. Typ Max. Unit
F
L-U
Frequency range in 802.11b/g and 256 QAM applica-
tions
2400 2500 MHz
P
OUT
Output power at 3% EVM with 802.11g OFDM at 54
Mbps
25 dBm
Output power at 1.75% dynamic EVM with MCS8, 40
MHz
23 dBm
Output power meeting 802.11g spectral mask 28.5 dBm
Output power meeting 256 QAM spectral mask 27 dBm
Output power meeting 802.11b spectral mask 28.5 dBm
G Power gain 32 33 dB
G
VAR
Gain variation over 40 MHz ±0.5 dB
2f Harmonics at 29 dBm, 802.11b mask compliance -21 dBm/MHz
2f Harmonics at 27 dBm -38 dBm/MHz

SST12CP12-QUCE

Mfr. #:
Manufacturer:
Microchip Technology
Description:
RF Amplifier
Lifecycle:
New from this manufacturer.
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