74ABT640PW,112

74HC244
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4
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input t
r
= t
f
= 6 ns)
Symbol Parameter
V
CC
(V)
Guaranteed Limit
Unit
– 55 to
25_C
v85_C v125_C
t
PLH
,
t
PHL
Maximum Propagation Delay, A to YA or B to YB
(Figures 1 and 3)
2.0
3.0
4.5
6.0
96
50
18
15
115
60
23
20
135
70
27
23
ns
t
PLZ
,
t
PHZ
Maximum Propagation Delay, Output Enable to YA or YB
(Figures 2 and 4)
2.0
3.0
4.5
6.0
110
60
22
19
140
70
28
24
165
80
33
28
ns
t
PZL
,
t
PZH
Maximum Propagation Delay, Output Enable to YA or YB
(Figures 2 and 4)
2.0
3.0
4.5
6.0
110
60
22
19
140
70
28
24
165
80
33
28
ns
t
TLH
,
t
THL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
3.0
4.5
6.0
60
23
12
10
75
27
15
13
90
32
18
15
ns
C
in
Maximum Input Capacitance 10 10 10 pF
C
out
Maximum ThreeState Output Capacitance
(Output in HighImpedance State)
15 15 15 pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON
Semiconductor HighSpeed CMOS Data Book (DL129/D).
C
PD
Power Dissipation Capacitance (Per Buffer)*
Typical @ 25°C, V
CC
= 5.0 V
pF
34
* Used to determine the noload dynamic power consumption: P
D
= C
PD
V
CC
2
f + I
CC
V
CC
. For load considerations, see Chapter 2 of the
ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
SWITCHING WAVEFORMS
Figure 1. Figure 2.
V
CC
GND
t
f
t
r
DATA INPUT
A OR B
OUTPUT
YA OR YB
10%
50%
90%
10%
50%
90%
t
TLH
t
PLH
t
PHL
t
THL
ENABLE
A OR B
OUTPUT Y
OUTPUT Y
50%
50%
50%
90%
10%
t
PZL
t
PLZ
t
PZH
t
PHZ
V
CC
GND
HIGH
IMPEDANCE
V
OL
V
OH
HIGH
IMPEDANCE
74HC244
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5
TEST CIRCUITS
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 3. Test Circuit
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 4. Test Circuit
CONNECT TO V
CC
WHEN
TESTING t
PLZ
AND t
PZL
.
CONNECT TO GND WHEN
TESTING t
PHZ
AND t
PZH
.
1 kW
PIN DESCRIPTIONS
INPUTS
A1, A2, A3, A4, B1, B2, B3, B4
(Pins 2, 4, 6, 8, 11, 13, 15, 17)
Data input pins. Data on these pins appear in noninverted
form on the corresponding Y outputs, when the outputs are
enabled.
CONTROLS
Enable A, Enable B (Pins 1, 19)
Output enables (activelow). When a low level is applied
to these pins, the outputs are enabled and the devices
function as noninverting buffers. When a high level is
applied, the outputs assume the high impedance state.
OUTPUTS
YA1, YA2, YA3, YA4, YB1, YB2, YB3, YB4
(Pins 18, 16, 14, 12, 9, 7, 5, 3)
Device outputs. Depending upon the state of the
outputenable pins, these outputs are either noninverting
outputs or highimpedance outputs.
LOGIC DETAIL
DATA
INPUT
A OR B
ENABLE A OR
ENABLE B
TO THREE OTHER
A OR B INVERTERS
ONE OF 8
INVERTERS
YA
OR
YB
V
CC
74HC244
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6
PACKAGE DIMENSIONS
TSSOP20
CASE 948E02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
110
1120
PIN 1
IDENT
A
B
T
0.100 (0.004)
C
D
G
H
SECTION NN
K
K1
JJ1
N
N
M
F
W
SEATING
PLANE
V
U
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
−−− −−−
S
U0.15 (0.006) T
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

74ABT640PW,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC TRANSCVR INVERT 5.5V 20TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
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