Characteristics STTH3002C
4/11
Figure 3. Forward voltage drop versus
forward current (maximum values,
per diode)
Figure 4. Relative variation of thermal
impedance junction to case versus
pulse duration
0
10
20
30
40
50
60
70
80
90
100
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
I(A)
FM
V(V)
FM
T =25°C
j
T =150°C
j
0.1
1.0
1.E-03 1.E-02 1.E-01 1.E+00
Z/R
th(j-c) th(j-c)
Single pulse
t(s)
p
Figure 5. Junction capacitance versus
reverse applied voltage (typical
values, per diode)
Figure 6. Reverse recovery charges versus
dI
F
/dt (typical values, per diode)
10
100
1000
0 50 100 150 200
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
0
25
50
75
100
125
150
175
200
225
250
10 100 1000
Q (nC)
rr
dI /dt(A/µs)
F
I =15A
F
V =160V
R
T =125°C
j
T =25°C
j
Figure 7. Reverse recovery time versus
dI
F
/dt (typical values, per diode)
Figure 8. Peak reverse recovery current
versus dI
F
/dt (typical values, per
diode)
0
10
20
30
40
50
60
70
10 100 1000
t (ns)
rr
dI /dt(A/µs)
F
T =25°C
j
T =125°C
j
I =15A
F
V =160V
R
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
10 100 1000
I (A)
RM
dI /dt(A/µs)
F
T =25°C
j
T =125°C
j
I =15A
F
V =160V
R
STTH3002C Ordering information scheme
5/11
2 Ordering information scheme
Figure 11. Ordering information scheme
Figure 9. Dynamic parameters versus
junction temperature
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each tab (Epoxy printed
circuit board FR4, e
CU
= 35 µm) for
D
2
PAK
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25 50 75 100 125 150
I
RM
Q
rr
T (°C)
j
Qrr;I [T ]/Qrr;I [T =125°C]
RM j RM j
I =15A
F
V =160V
R
0
10
20
30
40
50
60
70
80
0 2 4 6 8 10 12 14 16 18 20
S (cm²)
CU
R (° C/W)
th(j-a)
STTH 30 02 Cxx
Ultrafast switching diode
Average forward current
30 = 30 A
02 = 200 V
CT = TO-220AB in Tube
CW = TO-247 in Tube
CR = I
2
PAK in Tube
CG = D
2
PAK in Tube
CG-TR = D
2
PAK in Tape and reel
CPI = TOP3 in Tube
Repetitive peak reverse voltage
Package
Package information STTH3002C
6/11
3 Package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque values: TO-220AB 0.4 to 0.6 N·m, TO-247 0.55 N·m (1.0 N·m
maximum), TOP3I 0.9 to 1.2 N·m
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 6. TO-220AB dimensions
Ref.
DIMENSIONS
Millimeters Inches
Min. Typ Max. Min. Typ Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M2.60 0.102
C
b2
c2
F
Ø I
L
A
a1
a2
B
e
b1
I4
l3
l2
c1
M

STTH3002CT

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Rectifiers 2x15 Amp 200 Volt
Lifecycle:
New from this manufacturer.
Delivery:
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