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PMPB15XP,115

P1-P3P4-P6P7-P9P10-P12P13-P15
NXP Semiconductors
PMPB15XP
12 V, single P-channel Trench MOSFET
PMPB15XP All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved
Product data sheet 22 November 2012 9 / 14
V
GS
= 0 V
Fig. 16. Source current as a function of source-drain voltage; typical values
8. Test information
t
1
t
2
P
t
006aaa812
duty cycle δ =
t
1
t
2
Fig. 17. Duty cycle definition
9. Package outline
12-04-30Dimensions in mm
1.1
1.3
1.9
2.1
1.9
2.1
1.0
1.2
3
2
1
4
5
6
0.51
0.61
0.2
0.3
0.65
0.25
0.35
0.2
0.3
Fig. 18. Package outline DFN2020MD-6 (SOT1220)
NXP Semiconductors
PMPB15XP
12 V, single P-channel Trench MOSFET
PMPB15XP All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved
Product data sheet 22 November 2012 10 / 14
10. Soldering
1.35
1.25
1.05
0.9
1.1
1.2
2.5
0.935 0.935
SOT1220Footprint information for reflow soldering of DFN2020MD-6 package
sot1220_fr
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
0.33 (6×)
0.76
0.66
0.56
0.25 0.35 0.45
0.25 (6×)
0.35 (6×)
0.65
0.65
0.45 (6×)
0.43 (6×)
0.53 (6×)
2.06
0.775
0.285
Fig. 19. Reflow soldering footprint for DFN2020MD-6 (SOT1220)
NXP Semiconductors
PMPB15XP
12 V, single P-channel Trench MOSFET
PMPB15XP All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved
Product data sheet 22 November 2012 11 / 14
11. Revision history
Table 8. Revision history
Data sheet ID Release date Data sheet status Change notice Supersedes
PMPB15XP v.3 20121122 Product data sheet - PMPB15XP v.2
Modifications:
•
Table 7 "Characteristics": R
DSon
at V
GS
= -1.8 V corrected.
PMPB15XP v.2 20120719 Product data sheet - PMPB15XP v.1
PMPB15XP v.1 20120706 Preliminary data sheet - -
P1-P3P4-P6P7-P9P10-P12P13-P15

PMPB15XP,115

Mfr. #:
Buy PMPB15XP,115
Manufacturer:
Nexperia
Description:
MOSFET P-CH 12V 8.2A 6DFN
Lifecycle:
New from this manufacturer.
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